Manufacturing and processing contract

リード

Establishment1975 year
capital1000Ten thousand
number of employees40
addressYamaguchi/Ube-shi/Zenwa, Jishigaya 591-4
phone0
last updated：
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リード Product Lineup

1～7 item / All 7 items

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[Processing Example] Fixed Pitch Cut

Dicing that can cut various materials with high precision!

Fixed pitch cut Material: Silicon wafer Work thickness: 0.7mm Cut width: 0.05mm

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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[Processing Example] Multi-Size Cut

Dicing that can cut various materials with high precision!

Multi-size cut Material: Aluminum nitride Work thickness: 1.0mm Cut width: 0.1mm X direction: Fixed pitch Y direction: Multi-size pitch

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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[Processing Example] Multi-Angle Cut

High-precision dicing that can cut various materials!

Multi-angle cut Material: Aluminum nitride Work thickness: 1.0mm Cut width: 0.1mm

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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[Processing Example] Full Cut

Dicing that can cut various materials with high precision!

Full cut Material: Aluminum nitride Work thickness: 1.0mm Cut width: 0.1mm

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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[Processing Example] Half Cut

Dicing that can cut various materials with high precision!

Half cut Material: Aluminum nitride Work thickness: 1.0mm Cut width: 0.1mm Groove depth: 0.5mm

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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[Processing Example] Groove Cutting

Dicing that can cut various materials with high precision!

Groove cut Material: Aluminum nitride Workpiece thickness: 1.0mm Groove depth: 0.5mm

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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For those seeking high-precision finished dimensions in ceramic cutting.

How about cutting processing that can accurately cut not only width/depth/height but also right angles?

Cutting ceramics involves various requirements, including dimensions in the XYZ directions of width, depth, and height, as well as factors like perpendicularity. There are also various cutting methods, such as slicing, dicing, and laser cutting. Lead adopts the dicing method, which can comprehensively solve issues related to high finishing precision, variation control during mass production, and cost performance. Specifically, high finishing precision is achieved through image recognition, variation control during mass production is managed with NC control, and cost performance is ensured by utilizing mature technologies.

  • Fine Ceramics
  • Wafer processing/polishing equipment
  • Contract manufacturing

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