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  1. Home
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  3. Materials
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  5. Fine Ceramics
  6. [Processing Example] Groove Cutting

[Processing Example] Groove Cutting

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last updated:Apr 28, 2021

リード
リード
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Dicing that can cut various materials with high precision!

Groove cut Material: Aluminum nitride Workpiece thickness: 1.0mm Groove depth: 0.5mm

    Wafer processing/polishing equipmentContract manufacturingFine Ceramics
溝カット220220.png

[Processing Example] Groove Cutting

溝カット220220.png
溝カット220220.png
  • Related Link - https://www.lead-company.jp/

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basic information

Material: Aluminum Nitride Workpiece Thickness: 1.0mm Groove Depth: 0.5mm

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リード

リード

Manufacturing and processing contract

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We are a company based in Ube City, Yamaguchi Prefecture, with 50 years of history, primarily engaged in various processing of semiconductors and ceramic devices. Through many years of experience in responding to diverse needs, we have cultivated unwavering trust and technical expertise. We will continue to challenge ourselves to create new value through innovative approaches.

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