Achieving high flatness wafer processing! A wide range of equipment for silicon wafers that we handle is featured!
This catalog introduces the silicon wafer processing equipment handled by Speedfam. It includes the polishing device "DSM20B-5P-4D-AL" for double-sided simultaneous mirror polishing of φ300mm silicon wafers, the "EP-300-X" with a dry-in-dry-out structure, and the "EP-200-XW-II" capable of cassette-to-cassette and slot-to-slot wafer transport. Please make use of this for product selection. [Contents] ■DSM20B-5P-4D-AL ■EP-300-X ■EP-200-XW-II ■Fully Automated Single Side Polishing Line FAM 59SPAW *For more details, please refer to the PDF document or feel free to contact us.
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Speedfam Co., Ltd. is a company engaged in the manufacturing and sales of polishing equipment and more. In today's information society, where technological innovation is advancing at an accelerating pace, the flat surfaces required for various device substrates essential for cutting-edge products demand ultra-precision finishing at the nanometer level. The needs for flatness in this ultra-precision processing process have no limits, requiring the achievement of high-precision and stringent numerical targets in parallelism, dimensional control, and flatness, along with high productivity, improved yield, and maintenance of cleanliness. Speedfam responds to various customer needs by developing both "equipment" and "consumable materials" with innovative technology and know-how, and we propose optimal processing processes.