By miniaturizing, it is also possible to reduce flow rate! Introducing microchannel heat exchangers.
We would like to introduce our efforts to miniaturize heat exchangers. Heat exchangers with microchannels can be miniaturized without compromising heat exchange performance compared to those without microchannels. Additionally, miniaturization allows for flow rate reduction. At WELCON, we have reduced the volume to one-hundredth while maintaining the same performance using microchannels. You can find more details through the related links. [Overview] ■ Microchannel heat exchangers ■ Increased heat transfer area due to microchannel design ■ High corrosion resistance and heat resistance through solid-phase diffusion bonding *For more details, please refer to the PDF materials or feel free to contact us.
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High-performance, compact, lightweight, and thermal management components provided through fine diffusion bonding technology, contributing to energy savings. Not just bonding, but also one-stop shopping for structural design, thermal fluid design, and more. We accommodate everything from prototype single items to mass production. Capable of fine three-dimensional structures, surface bonding, laminated bonding of thin plates, and bonding of dissimilar materials. Suitable for mass production of prototypes for 3D laminated structures and 3D printers. Applicable to hollow components, fine three-dimensional structures, high-pressure and high-efficiency heat exchangers with fine flow paths, high-efficiency heat sinks, reactors, mixers, and more. Extensive experience and proven results in providing solutions across various industries, including automotive, medical devices, semiconductor manufacturing equipment, food equipment, special inspection devices, power, and electrical/electronic components. For more details, please contact us.
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