Ceramic substrate cutting device CSM-7000

Proposing a splitting method tailored to the condition of ceramic substrates, such as G&B method and P&B method. Achieving cost reduction and quality improvement through the automation of substrate splitting.

Introducing the ceramic substrate dicing equipment handled by Techno Alpha. We can propose and manufacture equipment tailored to the condition of ceramic substrates, such as the G&B method suitable for substrates that already have components mounted, and the P&B method aimed at mass production for white boards. We also accept consultations for dicing high-quality substrates for automotive applications. By automating the substrate dicing process, we achieve cost reduction and quality improvement. **Techno Alpha's Strengths** - **Over 30 Years of Experience**: Our staff, who have designed and manufactured numerous substrate dicing machines, support the entire application process from dicing methods to dicing conditions. - **Support for Various Dicing Methods**: Rather than simply dicing, we evaluate using jigs and determine the optimal method based on customer specifications, ensuring stable production after implementation. - **Comprehensive Proposals**: We can provide proposals (evaluations) that include laser scrubbing, and we can also manufacture equipment that integrates lasers with substrate dicing machines for excellent throughput. - **Advanced Technical Skills**: We also handle mounting equipment used after substrate dicing. With the advanced technical skills cultivated through our mounting equipment, we provide stable machines.

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