Compact design with FL +1000mm! Partial plating is also possible with drum plating.
Our company offers the 'REEL to REEL Ag Spot Plating Equipment' with automatic control using a touch panel and sequencer. By adopting an image processing system, we can reproduce plating area accuracy of ±0.07mm without pilot pins. Additionally, stable power supply and transport can be ensured with special power supply rollers and guide rollers. 【Equipment Overview】 ■ Number of Rows: 2 to 3 rows ■ Line Speed: Standard 3.6 to 4.0m/min ■ Target Products: Lead Frame, LED Frame, and others ■ Basic Plating Specifications: Cu + Ni + Ag Spot ■ Target Materials: 42 Alloy, Cu Alloy *For more details, please download the PDF or feel free to contact us.
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Our company designs and manufactures surface treatment equipment for connectors and lead frames, as well as various devices for semiconductor wafers. Based on the philosophy of supporting small-batch production and fine part plating, we supply original equipment tailored to our customers' needs with the concepts of "ease of use," "easy product switching," and "easy maintenance." In particular, we have a pioneering track record in plating equipment for semiconductor wafers, with over 100 units installed worldwide, continuously providing plating equipment that meets our customers' needs.