You can change the plating jig without stopping the other lanes!
Our company offers a compact design of the 'Short-Length Ag Spot Plating Device' with a convenient pass line of FL+1000mm. It adopts a special overflow method suitable for thin materials and multiple pins. Additionally, the loading section can switch between vacuum and chuck types. 【Device Overview】 ■ Basic Model: MMS-02 (03・04) ■ Number of Bars: 4 bars ■ Line Speed: 0.5m to 2.0m/min (Normal: 1.6m/min) ■ Pass Line: FL+1000mm ■ Cycle Time: 17.5 seconds/cycle (Machine: 8sec + Plating) and more *For more details, please download the PDF or feel free to contact us.
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【Overview of Other Equipment】 ■Conveying Method: Roller conveyor type, roller pitch = 20 to 40 mm ■Target Materials: 42 alloy or Cu alloy ■Target Products: IC lead frames ■Product Dimensions: Width 20 to 100 mm, Length 150 to 300 mm, Thickness 0.10 to 0.4 mm *For more details, please download the PDF or feel free to contact us.
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Our company designs and manufactures surface treatment equipment for connectors and lead frames, as well as various devices for semiconductor wafers. Based on the philosophy of supporting small-batch production and fine part plating, we supply original equipment tailored to our customers' needs with the concepts of "ease of use," "easy product switching," and "easy maintenance." In particular, we have a pioneering track record in plating equipment for semiconductor wafers, with over 100 units installed worldwide, continuously providing plating equipment that meets our customers' needs.