Use cassettes at the load/unload station!
We offer a "semiconductor rack-type semi-automatic plating device" that contributes to productivity improvement through parallel processing of two plates. Due to the presence of a buffer area for the fixtures, production can proceed without affecting user operation procedures. Additionally, we can provide equipment tailored to customer processes. Please feel free to contact us with your requests. 【Device Overview】 ■ Target Size: 6 inches to 12 inches ■ Target Plating: Composite such as Ni/Cu/Sn ■ Device Type: Semi-Automatic (Includes equipment for loading and unloading products onto the fixture) *For more details, please download the PDF or feel free to contact us.
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Our company designs and manufactures surface treatment equipment for connectors and lead frames, as well as various devices for semiconductor wafers. Based on the philosophy of supporting small-batch production and fine part plating, we supply original equipment tailored to our customers' needs with the concepts of "ease of use," "easy product switching," and "easy maintenance." In particular, we have a pioneering track record in plating equipment for semiconductor wafers, with over 100 units installed worldwide, continuously providing plating equipment that meets our customers' needs.
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