Various 3D data models can be created using ABS resin!
Our company handles the three-dimensional modeling system 'Dimension BST1200es, Catalyst EX', which allows for the creation of three-dimensional models by inputting 3D data created in CAD, melting ABS resin with heat, and layering it with a very fine pitch. After modeling, the models can be processed through painting, polishing, and other methods, enabling quick shape verification and functional assembly checks. Additionally, by streamlining the design process, it can significantly contribute to reducing lead times and costs. 【Features】 ■ Easy-to-use interactive Catalyst software ■ Simple cartridge-based material exchange ■ Safe design (no harmful substances or unpleasant odors generated) *For more details, please download the PDF or feel free to contact us.
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【Main Specifications】 ■ Printing Method: Fused Deposition Modeling (FDM) ■ Build Size: (W) 254mm × (D) 254mm × (H) 305mm ■ Layer Thickness: 0.254mm/0.33mm ■ Support Method: Breakaway ■ Driver Software: Catalyst EX (Input Format: STL file) ■ Material Supply Method: Cartridge ■ Materials: Model Material, Support Material (ABS Resin) *For more details, please download the PDF or feel free to contact us.
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The Fukuoka Prefectural Industrial and Scientific Technology Promotion Foundation's Three-Dimensional Semiconductor Research Center has facilities that can design, manufacture, test, evaluate, and analyze embedded substrates with active and passive components wired in three dimensions within printed circuit boards at mass production levels. In addition to a standard printed circuit board manufacturing line, it is equipped with mounting devices for embedding components within the substrate and high-temperature, high-humidity vibration testing equipment to evaluate connection reliability. Furthermore, there is an 8-inch silicon wafer line that allows for the development of test element group (TEG) chips for evaluation. Additionally, it is possible to develop three-dimensional stacking of chips using through silicon vias (TSV) and silicon interposers that use silicon substrates instead of printed circuit boards.