It is a cermet thermal spray material with excellent wear resistance and impact resistance.
This is a WC/CrC/Ni-based cermet thermal spray material produced by the granulation and sintering method. By strictly controlling particle size and granule strength, we achieve spitting prevention and excellent adhesion efficiency, resulting in a thermal spray coating with outstanding wear resistance and impact resistance. The W2000X series is highly tough compared to conventional cermet thermal spray materials and possesses extremely excellent impact resistance. When compared to typical WC/12wt%Co coatings, it has demonstrated more than double the durability in steel ball drop impact tests. [Application Examples] Leveraging its high impact resistance and toughness, it is used in a wide range of fields including construction, civil engineering, and machinery. Application examples: - Cutting bits - Construction machinery parts - Various rollers - Crusher parts - Various screws - Coater blades, etc. [Message] At Fujimi, we manufacture and sell many cermet materials beyond the W2000X series, and we can also prototype powders with adjusted WC particle size and composition according to customer requests. If you have any questions or requests regarding cermet materials, please feel free to contact us. *For product details, please refer to the catalog.
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【Examples of Use】 Utilizing high impact resistance and toughness, it is used in a wide range of fields such as construction, civil engineering, and machinery. Application examples: - Cutting bits - Construction machinery parts - Various rollers - Crusher parts - Various screws - Coater blades, etc.
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Fujimi Incorporated has been a pioneer in the precision artificial abrasive materials industry since its founding in 1950, continuing its unique journey by leveraging classification technology and other advancements. The products born from accumulated know-how and research and development capabilities have evolved from polishing materials for optical lenses to essential components in advanced industries requiring high precision, such as mirror polishing of semiconductor substrates represented by silicon wafers, CMP (Chemical Mechanical Planarization) necessary for multilayer wiring of semiconductor chips, and polishing of hard disks for computers. Recently, we have also been actively engaged in the development of polishing and grinding materials for surface processing in fields such as LED, displays, and power electronics, as well as in applied areas utilizing powder technology. Additionally, we provide thermal spray materials for various industries, including steel, aerospace, and semiconductors.