Formation of thin-film integrated circuits on stepped ceramic substrates.

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last updated：Mar 29, 2024

JAPAN FINE CERAMICS CO., LTD. （JFC） Tokyo Sales Office

We have made it possible to form thin-film integrated circuits on "stepped ceramic substrates," which eliminate the need for customer bonding processes and reduce thermal conduction loss.

This product was originally used by users who bonded two circuit boards together (after joining with solder, paste, and adhesive), and it was created with the concept of providing it as a "single integrated component." By making it a single component, (1) the user's effort and costs for joining are reduced, and (2) thermal conduction loss from joining materials has been eliminated. Furthermore, it has become possible to form thin-film integrated circuits on stepped ceramic substrates. [Application Example] The step difference between the upper and lower circuit boards is adjusted to match the thickness of the laser element, which is mounted on the lower board. This allows the top surface of the laser element and the upper circuit board to be at the same height, enabling wire bonding at the shortest distance.

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Depth of the groove: 0.1mm ±0.03mm Minimum pattern size of the thin-film integrated circuit on Side A: 0.03±0.01mm Minimum pattern size of the thin-film integrated circuit on Side C: 0.05±0.01mm Minimum pattern size of the AuSn pattern: 0.05±0.03mm *Possible to form on Side A and Side C R part: R ≦0.1mm Surface roughness of Side C: Ra≦1μm As a substrate manufacturer, we are capable of total technology development, quality assurance, and problem-solving. We also respond quickly to short delivery times and design changes.