Utilizing our many years of experience in deep silicon etching and MEMS processing, we create highly flexible structures tailored to our customers' designs. Please feel free to contact us!
Our company is a leading supplier of 100-150mm cavity bonding SOI wafers for a wide range of MEMS applications. We provide advanced wafer bonding technology that enables the materials of your cavity specifications to be transformed into innovative products. The cavity bonding SOI wafers from Ismos feature a structure with pre-etched cavities beneath a silicon thin film, allowing customers to design these into advanced devices that meet market demands. 【Features】 ■ Advanced bonding technology ■ Reduces adhesion issues during release ■ Streamlined manufacturing flow ■ Cost-effective Cavity SOI/Si-Si solutions ■ High flexibility in structures tailored to customer applications *For more details, please refer to the PDF document or feel free to contact us.
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【Last Resort】 ■Telecommunications ■Medical ■Automotive ■Home Appliances ■Musical Instruments *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■Pressure sensors ■Microphones ■Inertial MEMS ■Microfluidic devices ■Resonators *For more details, please refer to the PDF document or feel free to contact us.
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Our company was established in 2004 as a best-in-class supplier providing high-voltage power MOSFETs and MEMS technology processes that deliver high performance for power supplies, advanced technology base wafers, SOI (silicon on insulator), and bonded silicon substrates at a high cost-effectiveness. (Headquartered in the U.S., with manufacturing facilities in the U.K. and R&D in Tokyo) We have developed and realized high-voltage super junction MOSFETs with innovative deep trench etching MEMS structures through a simple and low-cost process. Please feel free to contact us if you have any inquiries.