TSV Wafer Solutions (Through-Silicon Via Solutions)

Suitable for substrates such as CMOS! The wafer remains a stable substrate even when exposed to diffusion processes at 1200°C.

Ice Moss Technology has developed an innovative and powerful internal interconnection technology for wafers. These serve as a means to solve packaging issues related to designs such as ICs and MEMS. This internal interconnection solution makes design easier and provides a way to facilitate wafer-level packaging, such as solder bump contacts. 【Features】 ■ Suitable for substrates like CMOS ■ The internal interconnection areas are etched into the wafer, with doped polysilicon embedded ■ The wafer maintains surface metal contamination standards and flatness, with particle levels meeting industry standards ■ The wafer remains stable even when subjected to a 1200°C diffusion process *For more details, please refer to the PDF document or feel free to contact us.

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