Achieving both UV positioning and high temperature and humidity resistance through thermal curing.
This is a heat-curing epoxy adhesive that can increase viscosity under UV irradiation. It allows for prevention of dripping during heating and easy positioning. It can also be used even if there are areas of the application surface that are not exposed to UV light. A standard for fiber optic bonding, 353ND, and a standard for optical component and glass bonding, 301-2, are the bases for this hybrid model, which boasts equivalent durability.
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basic information
HYB-353ND Series A series based on the standard EPO-TEK 353ND for optical fiber bonding, with good resistance to 85°C and 85% humidity testing. Variations in viscosity and thixotropy are available. HYB-297-RT Series A transparent epoxy adhesive based on the standard EPO-TEK 301-2 for bonding optical components and glass. It allows for simple temporary fixation with UV light while achieving room temperature curing in areas not exposed to UV.
Price range
P2
Delivery Time
Applications/Examples of results
Adhesion of the butterfly package lens Adhesion with fiber length control
Line up（3）
| Model number | overview |
|---|---|
| HYB-353ND | UV + heat curing adhesive based on 353ND |
| HYB-353ND-LV | Low viscosity model of HYB-353ND |
| HYB-353ND-HV | High viscosity model of HYB-353ND |
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Company information
Rikei Corporation was established in 1957 and is a solution vendor in the IT and electronics industry, celebrating its 65th anniversary. We propose a variety of solutions centered around cutting-edge technologies and advanced products in the fields of system solutions, network solutions, and electronic components and devices, tailored as the optimal "step-ahead solution" to meet our customers' needs.