For the electrical wiring in the engine room and the gasoline tank meter! Compared to glass epoxy substrates, it has a lower coefficient of thermal expansion and stronger resistance to heat.
The "metal-based heat dissipation substrate" is a substrate that improves heat dissipation through thermal conduction, alleviating thermal issues. There are applications in high-brightness LED lighting (for vehicles and floodlights), as well as in automotive electrical components, ECUs, EPS, and DC/DC converters. Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat. 【Features】 ■ A substrate that improves heat dissipation through thermal conduction by using metal as the base ■ Compared to standard glass epoxy substrates, it has a lower thermal expansion coefficient and greater resistance to heat *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Lineup】 ■ Copper foil: 35μm, 70μm (105μm, 175μm) ■ Insulation layer: 80μm, 100μm, 120μm ■ Aluminum: 0.8mm, 1.0mm, 1.5mm (2.0mm) *A6062, A5052 *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ High-brightness LED lighting (automotive, floodlights) ■ Automotive electrical components ■ ECU, EPS ■ Power MOSFET, IGBT ■ DC/DC converters *For more details, please refer to the PDF document or feel free to contact us.
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We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.
![Semiconductor heat dissipation substrate for the purpose of heat release and absorption [heat sink]](https://image.mono.ipros.com/public/product/image/403/2000449777/IPROS59561808384274111961.jpeg?w=280&h=280)
