Excellent insulation and corrosion resistance! The thermal conductivity ratio compared to PWB is about 50 times, sintered at approximately 1500°C!
"Alumina ceramic substrates" are products that can create electronic circuit boards using thick film printing technology. They are suitable for heat dissipation and high-reliability substrates. Circuits are formed on this product using thick film printing technology with silver-palladium, silver-platinum, gold, and other materials. They can suppress the temperature rise of electronic components and can be utilized for LED lighting and automotive electronic substrates. 【Features】 ■ Excellent heat resistance: Sintered at approximately 1500°C ■ Excellent heat dissipation: Thermal conductivity about 50 times that of PWB ■ Excellent insulation and corrosion resistance ■ Capable of creating electronic circuit boards using thick film printing technology ■ Suitable for heat dissipation and high-reliability substrates *For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
【Other Features】 ■ Circuits are formed on this product using thick film printing technology with silver-palladium, silver-platinum, gold, etc. ■ It can suppress the temperature rise of electronic components. *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Usage】 ■For LED lighting ■For automotive electronic circuit boards *For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
IAM Electronics Co., Ltd. has been engaged in the manufacturing of thick film electronic components since its establishment, growing as a key player in cutting-edge electronics with hybrid ICs, resistor networks, chip resistors, semi-fixed resistors, and chip resistor networks. Additionally, we have been working on steatite substrates, a type of ceramic for the electronics industry, since 1974, and began mass production of alumina ceramic substrates in 1984, achieving integrated production from materials to final products. Moving forward, we will continue to make efforts to contribute to the realization of a prosperous society through the electronics industry, manufacturing and selling even better products.
![Improving thermal conductivity of alumina substrates with printed circuit technology [For mounting power devices!]](https://image.mono.ipros.com/public/product/image/aef/2000837251/IPROS92922931863825394276.png?w=280&h=280)
