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  6. Improving thermal conductivity of alumina substrates with printed circuit technology [For mounting power devices!]

Improving thermal conductivity of alumina substrates with printed circuit technology [For mounting power devices!]

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last updated:Apr 27, 2023

共立エレックス
共立エレックス
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Leveraging the strengths of a "ceramics substrate specialized manufacturer," we have achieved "high thermal conductivity of alumina substrates" through via formation technology and printed circuit technology!

In the implementation of power devices, where applications are expanding in areas such as home appliances and EV vehicles, expectations for "thermal conductivity performance of the substrate" are rising significantly. Through the mass production achievements of our flagship high-power LED packages, we have developed technologies to improve heat dissipation performance associated with higher power output. In particular, we have received many inquiries regarding "improving thermal conductivity using general-purpose alumina ceramic substrates compared to aluminum nitride substrates, which excel in thermal conductivity" for ceramic circuit boards. We have achieved improvements in thermal conductivity by applying through-hole processing technology (via formation) and printed circuit technology, filling the via sections of alumina ceramic substrates with "metallic materials," while using general-purpose alumina ceramic substrates. For high-power LED package substrates, we have achieved a thermal conductivity of "369 W/mk" with alumina ceramic substrates. If you are facing challenges with "thermal measures" for ceramic substrate implementation of high-power power devices, please consult with us.

    Other electronic partsCircuit board design and manufacturingFine Ceramics
Al2O3_Ag_369Wmk.png

Improving thermal conductivity of alumina substrates with printed circuit technology [For mounting power devices!]

Al2O3_Ag_369Wmk.png
Al2O3_Ag_369Wmk.png
  • Improvement technology for heat dissipation performance using printed circuit technology.
  • Special site - Product/service details - https://pr.mono.ipros.com/kyoritsu-po/product/

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basic information

■ Alumina substrate ■ Printed circuit ■ Circuit formation technology by printing method ■ Packaging technology for high-brightness LEDs ■ Thick-film printed circuit board ■ Fine printed circuit board

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Applications/Examples of results

【Features】 Contributes to miniaturization/thinness Small-diameter through-hole structure Double-sided wiring of power lines Realization of reduced thermal resistance (thermal vias) Through-hole structure filled with conductive fillers Multilayer printed circuit structure Pad-on-via structure Laser processing also available 【Examples of Applications】 Oscillators, oscillation devices MEMS devices Thick-film circuit boards with built-in resistors Various sensor boards Hybrid ICs Insulating circuit boards

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Kyoritsu Elex Company Profile

Kyoritsu Elex Company Profile

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共立エレックス

共立エレックス

Ceramics

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Kyoritsu Elex Co., Ltd. is a specialized manufacturer of ceramic substrates for electronic circuits that has been in business for over half a century since its establishment. Our products are widely used as key components in the internal electronic parts of various products, including mobile phones, computers, LCD televisions, automotive control circuits, and more. Based on the know-how we have cultivated over the years, we aim to continue supplying products that meet the needs of the times to the ever-evolving electronics industry, and we aspire to contribute to the creation of a richer society.

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