The superiority of the Ebina proposal process! Achieving ultra-high density fine holes without cracks or chipping.
Our processing technology enables the creation of glass without cracks or chips, and allows for ultra-high-density fine holes. The roughness of the sidewalls of the through holes is Ra0.08μm. We can achieve smooth sidewalls, enabling miniaturization and integration of devices. The shapes of the through holes can be selected from straight, hourglass, or tapered. 【Features】 ■ No cracks or chips ■ Smooth sidewalls ■ Ultra-high-density fine holes ■ Miniaturization and integration of devices *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Design Rules (Excerpt)】 <Standard Design> ■ Size in: 4×4, 6×6 ■ Glass thickness (A) μm: 200-500 ■ Diameter of the top of the hole (B) μm: 30-100±5 ■ Diameter of the center of the hole (C): B/2+ ■ Pitch of the hole (D): 2×B *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Conducts electricity: Sensors, switches, semiconductor package substrates, inspection equipment ■ Conducts liquids: Micro nozzles, inkjet head components, inspection equipment ■ Conducts light: Light shielding plates, micro filters, electron beam apertures, precision light shielding plates, inspection equipment, displays *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Since its establishment in 1946, the company has continuously refined and innovated its technology development, consistently anticipating the intense changes in the times and markets, while responding to cutting-edge needs in surface treatment. In particular, based on the addition of required functions, the technology and management standards in plating processes, centered on "electroplating" and "electroless plating," which require advanced technology and quality such as adhesion, corrosion resistance, and precision, are recognized as top-level in the industry, earning high evaluation and trust from customers. *The company name was changed from "Ebina Denka Kogyo Co., Ltd." on April 1, 2024.
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