A high-current substrate suitable for miniaturized power devices!
The "Hybrid Copper Thickness Coexistence Substrate" is a high-current substrate that allows for the coexistence of 300μm thick copper foil and 70μm thin copper foil within the same layer, enabling switching between them. It achieves a reduction in assembly processes and component count, making it suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 ■ Switchable between 300μm and 70μm ■ 300μm and 70μm can be interwoven ■ Combination of copper inlays is possible *For more details, please download the PDF or feel free to contact us.
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【Specifications】 ■Copper foil thickness: Coexistence of 300um and 70um in the same layer ■Number of layers: 2 to 6 layers (varies depending on the combination of copper foils) ■Board thickness: 1.3 to 3.5mm ■Others: IVH compatible, can be combined with copper foil thicknesses of 400, 500, and below 240um ■Standards: UL certified ■Copper inlay: Supported *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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At Daiyoko Industrial Co., Ltd., the Printed Circuit Company is engaged in the development, design, manufacturing, and sales of printed circuit boards, including high heat dissipation substrates and high current substrates. We value the essence of manufacturing and take joy in being of service to others, aiming for growth through our business. Please feel free to contact us with any inquiries.
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