Build-up structure! Supports various interlayer connections with laser VIA, IVH, and through VIA.
We would like to introduce our high-speed signal and high-density substrate, the "Build-Up Substrate," which we handle. It supports build-up substrates from 4 layers to 16 layers, and thanks to its build-up structure, it accommodates various interlayer connections using laser vias, IVH, and through vias. It allows for the mounting of narrow-pitch components and high-density designs. Please feel free to consult us when you need assistance. 【Features】 ■ Supports build-up substrates from 4 layers to 16 layers ■ Allows for the mounting of narrow-pitch components and high-density designs *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■Wireless devices, surveillance cameras, currency processing machines, communication transmission devices, etc.
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Company information
Sanwa Electronic Circuit produces printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, computers, wireless devices, ETC, automotive equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies specializing in circuit boards, we integrated these companies in 2004 and launched as Sanwa Electronic Circuit Co., Ltd. with a new divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a dedicated printed circuit board company for over half a century, advancing alongside the progress of printed circuit boards. We sincerely appreciate your continued support and patronage.
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