Special printed circuit board manufacturing - thick copper foil substrate (high current substrate)
By using a special manufacturing method, it is possible to produce substrates with a copper thickness of up to 400μ.
When a standard thickness of 18μ copper foil carries a large current, it can generate high heat and, in some cases, may even break, which is very dangerous. Such substrates can be addressed by increasing the thickness of the copper foil, and K2 Corporation can manufacture substrates with thicknesses ranging from 35μ to 105μ using standard substrate manufacturing methods. Furthermore, by employing special manufacturing techniques, it is possible to produce substrates with a maximum copper foil thickness of 400μ. For more details, please contact us or refer to our catalog.
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【Features】 ○ Boards can be manufactured using standard substrate methods for thicknesses ranging from 35μ to 105μ. → When a large current flows through copper foil with a standard thickness of 18μ, it can generate high heat and, in some cases, lead to disconnection, which is very dangerous. Such substrates can be addressed by increasing the thickness of the copper foil; however, K2 Corporation can manufacture boards using standard substrate methods for thicknesses from 35μ to 105μ. ○ By employing special manufacturing methods, it is possible to produce substrates with a copper foil thickness of up to 400μ. ○ Capable of handling specifications that cannot be processed using conventional through-hole substrate manufacturing methods. ○ Based on past experience and achievements, we challenge various substrates and have succeeded in development. ○ Also capable of accommodating the precision of printed circuit boards. ● For more details, please contact us or refer to the catalog.
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In recent years, printed circuit boards have become increasingly precise and diverse. The demands from our customers for prototype manufacturers of printed circuit boards continue to rise daily, making flexible responses essential. K2 Corporation has been able to meet these demands by producing a wide variety of substrates in a short lead time through in-house integrated production. "Good products faster and more reliably" is our company policy, which may seem obvious, but we believe it encapsulates our customers' requests. All of our employees strive daily to achieve this fundamental goal, engaging in trial and error.
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