A high-current, high-heat-dissipation substrate that achieves effective heat dissipation!
The "copper inlay substrate" is used in a wide range of fields and is particularly adopted as a critical component related to human life in automotive applications, being a high-current and high-heat-dissipation substrate. It achieves an excellent cost-performance heat dissipation method. By pressing copper directly beneath heat-generating components, it effectively dissipates heat. Additionally, eliminating the need for screw fastening for each heat-generating component enhances reliability, reduces costs, and decreases assembly labor. 【Features】 ■ Compared to aluminum heat dissipation substrates, the lower coefficient of thermal expansion of copper improves the reliability of solder joints. ■ Compared to aluminum heat dissipation substrates, it allows for the use of high multilayer substrates and double-sided mounted substrates, increasing design flexibility. ■ Increased circuit efficiency due to greater freedom in component placement. ■ Miniaturization. ■ Both SMD and lead components can adopt the same heat dissipation structure. *For more details, please download the PDF or feel free to contact us.
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basic information
【Copper Inlay Board Specifications】 ■ Copper foil thickness: 15–500μm ■ Diameter: φ3/4/5/6mm ■ Board thickness: 1.0–3.5mm * Diameter restrictions apply based on board thickness. * For more details, please download the PDF or feel free to contact us.
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At Daiyoko Industrial Co., Ltd., the Printed Circuit Company is engaged in the development, design, manufacturing, and sales of printed circuit boards, including high heat dissipation substrates and high current substrates. We value the essence of manufacturing and take joy in being of service to others, aiming for growth through our business. Please feel free to contact us with any inquiries.
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