With a rich lineup of copper foil thicknesses, we can accommodate current values from a few amperes to several hundred amperes!
The "High Current Substrate" is a printed circuit board that can carry large currents ranging from several tens to several hundred amperes, featuring thick copper foil. We offer "Ultra Thick Copper High Current Substrates" that use copper thicknesses of 300μm, 400μm, and 500μm, exceeding the conventional copper thickness of 105 to 240μm, as well as "Irregular Copper Thickness Coexisting Substrates" suitable for power devices represented by GaN and SiC, which are becoming more compact. 【Features】 - In the case of 300μm, coexistence with 50μm thin copper foil is possible in the same layer. - For thicknesses of 500μm or more, it is possible to draw copper foil out of the substrate from the inner or outer layers. - Exposure within the substrate is also possible. - Terminal processing, bending processing, and three-dimensional shaping of the substrate are possible. *For more details, please download the PDF or feel free to contact us.
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basic information
【Manufacturable Copper Foil Thickness】 ■ Copper foil thickness: 18/35/70/105/140/175/210/240/300/400/500/600/800/1000/1200/1600/2000um ■ Thick copper foil substrate: Copper foil thickness 105–240um ■ Ultra-thick copper foil substrate: Copper foil thickness 300, 400, 500um ■ Substrate with coexistence of different copper thickness: Coexistence of 300um and 70um copper foil thickness in the same layer ■ Busbar substrate: Copper foil thickness Max 2000um *For more details, please download the PDF or feel free to contact us.
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At Daiyoko Industrial Co., Ltd., the Printed Circuit Company is engaged in the development, design, manufacturing, and sales of printed circuit boards, including high heat dissipation substrates and high current substrates. We value the essence of manufacturing and take joy in being of service to others, aiming for growth through our business. Please feel free to contact us with any inquiries.