Would you like to try corner processing?

Yamamoto Binita Co., Ltd. will exhibit at the "Japan Woodworking Machinery Exhibition 2021" held at "Port Messe Nagoya." We will present the next-generation advanced BONDEX-V type and BONDEX-VX type high-frequency flash bonding machines with a new brand image, completely renewing design, efficiency, and operability. The main features are: - Automatic detection of product size for automatic setting of heating conditions - Improved heating efficiency through the adoption of a new high-frequency circuit: reduced heating cycle time - Space-saving and compact design achieved by integrating the high-frequency oscillator into the machine's furnace We will showcase three initial models: - MP-12MH type high-frequency flat heating treatment device with a board jointing function for heating single boards - WALLEX-3AE/3VE type high-frequency bonding machine for ceramic exterior wall corners, featuring spacer-less width adjustment - Other exhibited machines: - High-frequency ceramic corner bonding machine: rotary two-surface type - High-frequency ceramic corner bonding machine: U-shaped multifunction type - High-frequency compact heating device: iron type and gun type - Laminated film bonding machine: for manufacturing bending bonds of different materials such as wood, resin, and metal We look forward to your visit.