I learned about the tremendous efforts towards the reconstruction of the world-famous Berlin City Hall!
On May 17, 2018, approximately 50 European professionals from industry and academia participated in Fine Tech's Micro Assembly Day 2018. This one-day conference, held annually in Berlin, was organized to facilitate active knowledge sharing and experience exchange regarding new trends in high-precision packaging and micro assembly. In this blog, we introduce "Micro Assembly Day 2018 a Success." *For more detailed information, please refer to the PDF document. Feel free to contact us for more details.*
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*You can view the detailed content of the blog in the PDF document. For more information, please feel free to contact us.*
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*You can view the detailed content of the blog in the PDF document. For more information, please feel free to contact us.*
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Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.