We are prepared to provide timely support that is often required in the healthcare market.
Fine Tech participated in the IMAPS Advanced Packaging for Medical Microelectronics Workshop held in San Diego, and it did not disappoint. It was an honor to see Fine Tech mentioned in several technical presentations regarding various interesting biomedical applications. In a presentation from Lawrence Livermore National Labs, they discussed the development of a bionic retina, which is provided as a biocompatible electronic package that includes electronic devices to stimulate the retina using semiconductor technology. This blog introduces "Technology in Biomedical Applications." *For more details, you can view the PDF materials. Please feel free to contact us for more information.*
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*You can view the detailed content of the blog in the PDF document. For more information, please feel free to contact us.*
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*You can view the detailed content of the blog in the PDF document. For more information, please feel free to contact us.*
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Fine Tech is a manufacturer of die bonders and flip chip bonders, headquartered in Berlin, Germany, specializing in the development, design, and manufacturing of high-precision die bonding equipment, consistently providing cutting-edge assembly technology. We strive to support all our customers, ranging from venture companies to multinational corporations, universities, and government agencies, across various fields including electronics, electronic devices, optical components, aerospace, medical, and military. Fine Tech Japan Co., Ltd. was established on August 1, 2014, as a base for sales and application support related to die bonding for Japanese customers, and we are actively working to provide the latest assembly technology to our customers in Japan.