LPKF CuttingMaster Series
LPKF CuttingMaster Series
Laser substrate cutting machine - carbonization-free also possible
We can propose solutions to the following requirements in electronic circuit board manufacturing. Requirement 1: Miniaturization => Solution: The distance between mounted components or patterns and cutting lines can be reduced. Requirement 2: Eliminate impact during board separation. => Solution: Laser board separation is a non-contact process, so it does not impart shock to the workpiece. Regarding thermal shock, it does not exceed reflow temperatures. Requirement 3: Suppression of cutting debris => Solution: In laser cutting, cutting debris is sublimated and collected by a dust collector, minimizing debris. Other advantages of laser cutting: Features of the Laser Board Separation Machine CuttingMaster Series No carbonization Relaxation of cutting shape and mounted component layout restrictions Flexibility in editing cutting lines Reduction in material costs (layout size > 30% reduction) Automation compatibility is also possible (supports SMEMA, OPC-UA) If you need further information, please feel free to contact us.
Inquire About This Product
basic information
Cutting and slicing possible sizes: 350mm x 350mm (CM2000 series), 500mm x 350mm (CM3000 series) Laser type: UV laser, green laser Laser output: 27W (UV laser), 65W (green laser) Applications: Electronic circuit board cutting, surface processing, etc. Target materials: Glass epoxy boards, ceramic boards, etc.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
Automotive parts, medical applications, wearable devices, and many other successful adoptions.
Detailed information
-
CuttingMaster 2000P Appearance Image CM2240P Footprint: 875 mm x 1,510 mm (2,070 mm, status light) x 1,125 mm
-
Cut surface image Processing without carbonization is also possible.
-
It is possible to set the cut line closer to the wiring pattern <= A solution for miniaturization.
-
Zero impact during cutting <= Non-contact processing
-
Beam diameter = Tool diameter is 20µm.
-
Adoption in numerous automotive parts (proven track record for electronic circuit boards for Japanese cars).
-
Achieving precision machining that contributes to miniaturization.
Line up（4）
| Model number | overview |
|---|---|
| LPKF CuttingMaster 2000P Series | Manual loading method, processing size: 350mm x 350mm, select laser according to usage. |
| LPKF CuttingMaster 2000Ci Series | Conveyor connection automation compatible type, processing size: 300mm x 250mm, select a laser according to the intended use. |
| LPKF CuttingMaster 3000P Series | Manual loading method, processing size: 500mm x 350mm, select laser according to usage. |
| LPKF CuttingMaster 3000Ci Series | Conveyor connection automation compatible type, processing size: 460mm x 305mm, select laser according to usage. |
catalog（1）
Download All Catalogs
Company information
Our company name, BRUX, is derived from the German word "Bruecke," which means "bridge." As the name suggests, we strive to be a bridge connecting technology between Japan and the world, leveraging our extensive experience in international trade and the technical support we continuously accumulate to be of service to everyone.
