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  6. [Example of analysis using EBSD] Silicon wafer

[Example of analysis using EBSD] Silicon wafer

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last updated:Jun 26, 2025

アイテス
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The measured silicon wafer is single crystal! The IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes.

Here is a case study of silicon wafers analyzed using EBSD. A small piece was cut from the wafer, and an IPF map was obtained for a central area of 50×50μm. The measurement area shows red, indicating the {001} plane, and the absence of grain boundaries confirms that it is a single crystal. Since the measured silicon wafer is a single crystal, the IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes. *For more details, please refer to the PDF document or feel free to contact us.*

    Analytical Equipment and DevicesAnalysis Services
2021-07-02_17h05_08.png

[Example of analysis using EBSD] Silicon wafer

2021-07-02_17h05_08.png
2021-07-02_17h05_08.png 2021-07-02_17h05_12.png 2021-07-02_17h05_23.png 2021-07-02_17h05_26.png 2021-07-02_17h05_40.png
  • Related Link - https://www.ites.co.jp/
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[Analysis Example by EBSD] Chip

[Analysis Example by EBSD] Chip

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[Example of analysis using EBSD] Screw

[Example of analysis using EBSD] Screw

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[Example of analysis using EBSD] Pipe

[Example of analysis using EBSD] Pipe

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[Example of analysis using EBSD] Via

[Example of analysis using EBSD] Via

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[Example of Analysis by EBSD] High Melting Point Solder

[Example of Analysis by EBSD] High Melting Point Solder

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Example of analysis using EBSD: steel plate

Example of analysis using EBSD: steel plate

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Crystal analysis by EBSD BGA

Crystal analysis by EBSD BGA

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Crystal analysis by EBSD: Intermetallic compounds in solder joints

Crystal analysis by EBSD: Intermetallic compounds in solder joints

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EBSD analysis

EBSD analysis

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Crystal analysis of Cu using the EBSD method.

Crystal analysis of Cu using the EBSD method.

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Example of analysis using the EBSD method

Example of analysis using the EBSD method

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EBSD analysis of flexible printed circuits (FPC)

EBSD analysis of flexible printed circuits (FPC)

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Example of analysis using EBSD (ceramics)

Example of analysis using EBSD (ceramics)

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[Data] Whisker Analysis by EBSD

[Data] Whisker Analysis by EBSD

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Example of analysis using EBSD: crab claw

Example of analysis using EBSD: crab claw

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Crystal analysis by EBSD: Aluminum weld joint (spot welding)

Crystal analysis by EBSD: Aluminum weld joint (spot welding)

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[Example of analysis using EBSD] Silicon wafer

[Example of analysis using EBSD] Silicon wafer

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[Case of EBSD] Comparison of two brass materials

[Case of EBSD] Comparison of two brass materials

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

Example of analysis of compounds at the interface between SAC solder and Ni pads.

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Example of analysis of compounds at the SAC solder and Ni pad interface.

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We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

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アイテス

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Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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