Example of analysis of compounds at the SAC solder and Ni pad interface.

It is also possible to display various maps of each phase! Analysis is based on the information of the crystal structure possessed by the sample.

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. [Summary] < Elemental Analysis by EDX > - Surface analysis shows the distribution of Ni, Cu, and Sn within the compounds. < Crystallographic Orientation Analysis by EBSD > - By combining this with elemental analysis using EDX, it is possible to estimate the composition. - In some cases, analysis can be performed using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes. *For more details, please download the PDF or feel free to contact us.

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By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

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We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Introducing the perspectives from which analysis and analytical techniques should be advanced!

Our company supports customers in solving their challenges and issues not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point for problem-solving and provides assistance in unraveling issues for our customers. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

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I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.

We will introduce an example of analysis of the chip surface wiring (Al) using EBSD. The package resin was opened using a chemical solution/RIE, and an analysis of the Al pattern on the chip surface was conducted using EBSD. As a result, orientation was observed in the Al wiring. The normal orientation is distributed, and it is believed that many crystals are present. 【Overview】 ■ Analysis Method - The package resin was opened using a chemical solution/RIE. - An analysis of the Al pattern on the chip surface was conducted using EBSD. ■ Results - Orientation was observed in the Al wiring. *For more details, please refer to the PDF document or feel free to contact us.

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We will introduce an example of analysis using EBSD for screws (Cu2Zn).

The EBSD method allows us to confirm the distribution of crystal sizes and the orientation of crystal orientations. In this case, it was found that there is a significant orientation difference in the valleys of the screw, suggesting that there is a large residual stress. Additionally, it was observed that small crystal grains are distributed on the surface of the screw. [Summary] ■ Analysis Method - Observation of crystal structure using EBSD ■ Results - It was found that there is a significant orientation difference in the valleys of the screw - It is inferred that there is a large residual stress - It was also observed that small crystal grains are distributed on the surface of the screw *For more details, please refer to the PDF document or feel free to contact us.

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I will introduce an example of analysis using EBSD for pipes (austenitic).

Aites Co., Ltd. conducts analysis using EBSD on pipes. With the EBSD method, it is possible to confirm the distribution of crystal sizes and to check the orientation. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. 【Overview】 ■ Confirmation of crystal size distribution and orientation ■ Visualization of features that appear in the graph *For more details, please refer to the PDF document or feel free to contact us.

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The EBSD method allows for the estimation of crystal size distribution and residual stress.

We will introduce an example of analysis using EBSD for vias (Cu) formed in a multilayer substrate. With the EBSD method, it is possible to infer the distribution of crystal sizes and residual stress. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. 【Overview】 ■Observation of crystal structure using EBSD ・IPF map ・GROD map ・Crystal grain distribution map *For more details, please refer to the PDF document or feel free to contact us.

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Observing crystal structures with EBSD! Data can be obtained for each metal.

We will introduce an example of analysis using EBSD for high melting point solder (Pb-based solder containing a small amount of Sn). With the EBSD method, it is possible to infer the grain distribution and residual stress. Additionally, there are analyses that can be performed simultaneously for metals with different crystal structures, allowing for data acquisition for each metal. 【Features】 ■ Ability to infer grain distribution and residual stress ■ Simultaneous analysis for metals with different crystal structures is possible, enabling data acquisition for each metal *For more details, please refer to the PDF document or feel free to contact us.

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Visualize the features that appear in the graph! You can check the distribution of crystal sizes and the orientation of crystal directions.

We will introduce an example of analysis using EBSD for steel (Fe). Using histograms of gradients and corresponding grain distribution maps, IPF maps, and grain distributions, we observe the crystal structure with EBSD. The EBSD method allows us to confirm the distribution of crystal sizes and the orientation of crystal directions, and by highlighting on the map, we can visualize the features that appear in the graphs. 【Overview】 ■Observation of crystal structure using EBSD ・IPF map ・Grain distribution map ・Grain distribution *For more details, please refer to the PDF document or feel free to contact us.

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The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.

Here is an example of the analysis of BGA (Ball Grid Array). In the observation using a microscope, both optical microscopy and SEM are employed. In the crystal analysis using the EBSD method, we utilize the Phase map, Sn Grain map, Sn IPF map, and Sn GROD map, which allow for the inference of crystal states and residual stresses. 【Overview】 ■ Crystal analysis using the EBSD method - Phase map - Sn Grain map - Sn IPF map - Sn GROD map *For more details, please refer to the PDF materials or feel free to contact us.

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We will introduce an example of crystal analysis of intermetallic compounds at solder joints.

SEM images, phase maps, and IQ maps of Cu6Sn5 highlighted for each crystal grain, as well as IQ maps of Cu6Sn5 highlighting the rotation angles of grain boundaries, were used to analyze the crystals using the EBSD method. Compounds such as Cu6Sn5 and Ag4Sn are growing at the Cu pad/solder interface, and the distribution of crystal sizes and crystal inclination angles can be shown using histograms. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. [Overview] ■ Crystal analysis using the EBSD method - SEM images - Phase maps - IQ maps of Cu6Sn5 (highlighted for each crystal grain) - IQ maps of Cu6Sn5 (highlighting the rotation angles of grain boundaries) *For more details, please refer to the PDF document or feel free to contact us.

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Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.

The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution by calculating the crystal orientation of patterns continuously captured based on the information of the crystal structure of the sample. Materials with a crystalline structure, such as metals and ceramics, are thought to be composed of numerous crystal lattices like cubic ones, and this analytical method examines the orientation of these lattices (crystal orientation). Various maps are used, including IQ maps (Image Quality Maps), IPF maps, GROD maps, and pole figures. 【Features】 ■ The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution. ■ Uses the TSL Solutions OIM7.0 crystal orientation analysis device. ■ Analyzes the orientation of the crystal lattice (crystal orientation). ■ Changes in crystal orientation and grain size due to different processing conditions (such as rolling and extrusion) can be analyzed. *For more details, please refer to the PDF document or feel free to contact us.

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Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the electron diffraction patterns generated by electron beam irradiation and maps this information. Furthermore, it is a technique for investigating not only crystal orientation (texture) but also material microstructural states such as grain distribution and stress-strain as quantitative and statistical data. In the observation of changes before and after compression of a copper plate, IQ maps, GROD maps, and IPF maps (in the Axis 3 direction) can be used to compare the halving of crystal grain size before and after compression. 【Features】 ■ Obtains and maps orientation information of individual crystals ■ Investigates material microstructural states such as crystal orientation, grain distribution, and stress-strain *For more details, please refer to the PDF document or feel free to contact us.

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We will introduce an example of the analysis of EBSD patterns (Kikuchi patterns) at gold wire bond joints.

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the electron diffraction patterns generated by electron beam irradiation and maps this information. It is a technique used to investigate not only crystal orientation (texture) but also material microstructural states such as grain distribution and stress-strain as quantitative and statistical data. For example, when the sample is tilted significantly in a SEM and the electron beam is irradiated, if the sample is crystalline, electron diffraction occurs within the sample. By indexing the resulting pattern, it becomes possible to determine the crystal orientation at that point. By observing the differences in crystal orientation, it is possible to infer the residual stress within the crystal grains. 【Features】 ■ Obtains and maps orientation information of individual crystals ■ Investigates material microstructural states such as crystal orientation, grain distribution, and stress-strain ■ Allows inference of residual stress within crystal grains by observing differences in crystal orientation *For more details, please refer to the PDF document or feel free to contact us.

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Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

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You can closely observe the solder joint condition of electronic components on the implementation board and the internal structure of the components!

Our company conducts "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks and voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, while for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

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Introducing a case study analyzing whiskers that occurred on the lead terminals of an IC package!

This document introduces a case study on whiskers that occurred on the lead terminals of IC packages, where cross-sections were created through mechanical polishing, followed by SEM observation and EBSD analysis. It includes surface SEM images of the IC package as well as cross-sectional SEM images. It is evident that the crystal grains and grain boundaries measured by the EBSD method are consistent. We encourage you to read it. 【Published Cases】 ■Observation/Cross-section Preparation ■Analysis by EBSD *For more details, please refer to the PDF document or feel free to contact us.

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Here is an example of analysis regarding the broken part of a crab claw that was damaged due to long-term use!

We conducted observations, elemental analysis, and EBSD analysis on the fracture area of the damaged crab claw due to long-term use, and we would like to present our findings. In the elemental analysis using EDX, the mapping analysis revealed the distribution of Sb at the grain boundaries of the Pb crystals. Additionally, the EBSD method allowed us to confirm the orientation and misorientation of the crystal grains. 【Analysis Summary】 ■ Elemental Analysis by EDX - The mapping analysis showed the distribution of Sb at the grain boundaries of the Pb crystals. ■ Analysis by EBSD - The EBSD method enabled us to confirm the orientation and misorientation of the crystal grains. *For more details, please refer to the PDF document or feel free to contact us.

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We will introduce an analysis example confirming that the welded area has a large distribution of grain crystals.

As a case study of EBSD, we conducted an analysis of the cross-section of an aluminum welding joint from the cross-sectional direction, which I would like to introduce. For a sample where an aluminum plate was spot welded to an aluminum case, we prepared a cross-section of the weld and performed EBSD analysis. In the distribution of grain sizes, it was confirmed that the weld area has a greater number of larger grains compared to the base material. [Analysis Overview] ■ Visualization of Grain Structure - It is evident that the shape and size of the grains in the weld area differ from those in the base material. ■ Distribution of Grain Sizes - It can be confirmed that the weld area has a greater distribution of larger grains compared to the base material. *For more details, please refer to the PDF document or feel free to contact us.

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The measured silicon wafer is single crystal! The IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes.

Here is a case study of silicon wafers analyzed using EBSD. A small piece was cut from the wafer, and an IPF map was obtained for a central area of 50×50μm. The measurement area shows red, indicating the {001} plane, and the absence of grain boundaries confirms that it is a single crystal. Since the measured silicon wafer is a single crystal, the IPF map, pole figure, and inverse pole figure resulted in relatively simple outcomes. *For more details, please refer to the PDF document or feel free to contact us.*

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Visualizing the differences between two samples based on differences in crystal structure! Introducing a case study of EBSD analysis.

Here is a case study comparing two types of brass with similar elemental compositions. When spectral analysis was performed using SEM-EDX, it was found that brass mainly consists of Cu (copper) and Zn (zinc), and the elemental compositions of both samples appeared to be relatively similar. Additionally, an EBSD analysis was conducted, and the phase map revealed the presence of a β phase with a different crystal structure in part of Sample 1. [Case Overview] <Comparison of Two Brass Materials through Elemental Analysis> ■ Analysis Method: SEM-EDX Analysis ■ Results - Spectral analysis indicated that brass mainly consists of Cu (copper) and Zn (zinc), and the elemental compositions of both samples appeared to be relatively similar. - Surface analysis was conducted for elements Cu and Zn, and no bias in the in-plane distribution was observed. *For more details, please refer to the PDF document or feel free to contact us.

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Do you have any concerns or requests regarding wired bed exit sensors? × Tangling and tripping of wired cables × Cable disconnection or damage × Worry about forgetting to turn on the switch after temporarily stopping the sensor. × Want to be notified of bed exit even from a location away from the nurse call outlet. Such concerns can be resolved simply by connecting to a wireless set linked to the nurse call system! Our nurse call linked wireless set allows you to connect bed exit sensors like "Ugo-kun," "Foldable Thin Matta-kun," "Ayumi-chan," and "Just Place Pole-kun" to transmitters and receivers, reducing wiring around the bed, alleviating concerns about tripping and falling due to cables, and contributing to a tidier work environment. Furthermore, it enables the use of bed exit sensors even from locations away from the nurse call outlet, allowing for more flexible equipment placement.

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

Hotron's vehicle detection sensors allow you to search for products that meet your needs in three categories: "Purpose of Use," "Location of Use," and "Product List." The sensors detect the passage of vehicles, alerting you with rotating lights or switching the display of parking availability. They manage vehicle presence, full parking, and exit warnings in parking lots, contributing to safe driving and smooth operational management within the parking area. They are used in various settings, from coin-operated parking to large-scale parking lots.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The RNP-45 is a surface mount power film resistor designed to be compatible with the TO-252 package, weighing only 0.33 grams, with a thermal resistance of 3.0°C/W and a rated power of 45W. The resistive element is a pulse-resistant thick film, featuring excellent high-frequency characteristics with a reactance component of 2.7pF and 14.7nH, while also having a pulse power performance of 1kW-1µs despite its small size. The operating temperature range is from -55 °C to +175 °C. Additionally, it incorporates several design features, such as the removal of the metal flange to maximize the thermal performance of the resistor, compatibility with standard reflow SAC solder joints instead of wire bond connections, making it suitable for automatic mounting, an increased resistive element area to enhance surge performance, and the adoption of a 0.8mm substrate to strengthen bending stress.