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  6. Crystal analysis of Cu using the EBSD method.

Crystal analysis of Cu using the EBSD method.

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last updated:Jun 26, 2025

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Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the electron diffraction patterns generated by electron beam irradiation and maps this information. Furthermore, it is a technique for investigating not only crystal orientation (texture) but also material microstructural states such as grain distribution and stress-strain as quantitative and statistical data. In the observation of changes before and after compression of a copper plate, IQ maps, GROD maps, and IPF maps (in the Axis 3 direction) can be used to compare the halving of crystal grain size before and after compression. 【Features】 ■ Obtains and maps orientation information of individual crystals ■ Investigates material microstructural states such as crystal orientation, grain distribution, and stress-strain *For more details, please refer to the PDF document or feel free to contact us.

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Crystal analysis of Cu using the EBSD method.

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  • Related Link - http://www.ites.co.jp/analyze.html
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Observation of changes before and after compression on copper plates ■IQ Map ■GROD Map ■IPF Map (Axis 3 direction) *For more details, please refer to the PDF document or feel free to contact us.

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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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Regarding the bonding interface of Cu wire bonding.

Regarding the bonding interface of Cu wire bonding.

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[Information] Regarding the bonding interface of Cu wire bonding.

[Information] Regarding the bonding interface of Cu wire bonding.

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Crystal analysis of Cu using the EBSD method.

Crystal analysis of Cu using the EBSD method.

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Example of analysis using the EBSD method

Example of analysis using the EBSD method

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[Example of analysis using EBSD] Screw

[Example of analysis using EBSD] Screw

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Crystal analysis by EBSD BGA

Crystal analysis by EBSD BGA

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Example of analysis using EBSD: steel plate

Example of analysis using EBSD: steel plate

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EBSD analysis

EBSD analysis

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Crystal analysis by EBSD: Intermetallic compounds in solder joints

Crystal analysis by EBSD: Intermetallic compounds in solder joints

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[Example of analysis using EBSD] Pipe

[Example of analysis using EBSD] Pipe

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[Example of analysis using EBSD] Via

[Example of analysis using EBSD] Via

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[Example of Analysis by EBSD] High Melting Point Solder

[Example of Analysis by EBSD] High Melting Point Solder

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[Analysis Example by EBSD] Chip

[Analysis Example by EBSD] Chip

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[Data] Whisker Analysis by EBSD

[Data] Whisker Analysis by EBSD

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Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX.

Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX.

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Crystal analysis by EBSD: Aluminum weld joint (spot welding)

Crystal analysis by EBSD: Aluminum weld joint (spot welding)

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[Example of analysis using EBSD] Silicon wafer

[Example of analysis using EBSD] Silicon wafer

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[Case of EBSD] Comparison of two brass materials

[Case of EBSD] Comparison of two brass materials

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

Example of analysis of compounds at the interface between SAC solder and Ni pads.

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Example of analysis of compounds at the SAC solder and Ni pad interface.

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We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

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Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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