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  6. [Case of EBSD] Comparison of two brass materials

[Case of EBSD] Comparison of two brass materials

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last updated:Jun 26, 2025

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Visualizing the differences between two samples based on differences in crystal structure! Introducing a case study of EBSD analysis.

Here is a case study comparing two types of brass with similar elemental compositions. When spectral analysis was performed using SEM-EDX, it was found that brass mainly consists of Cu (copper) and Zn (zinc), and the elemental compositions of both samples appeared to be relatively similar. Additionally, an EBSD analysis was conducted, and the phase map revealed the presence of a β phase with a different crystal structure in part of Sample 1. [Case Overview] <Comparison of Two Brass Materials through Elemental Analysis> ■ Analysis Method: SEM-EDX Analysis ■ Results - Spectral analysis indicated that brass mainly consists of Cu (copper) and Zn (zinc), and the elemental compositions of both samples appeared to be relatively similar. - Surface analysis was conducted for elements Cu and Zn, and no bias in the in-plane distribution was observed. *For more details, please refer to the PDF document or feel free to contact us.

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[Case of EBSD] Comparison of two brass materials

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【Other Case Overview】 <Comparison of Two Brass Materials Using EBSD> ■Analysis Method: EBSD Analysis ■Results  ・Upon examining the phase map, a β phase with a different crystal structure was observed in part of Sample 1.  ・Since Sample 1 contains a β phase, it is expected that there is a difference in material properties between the two samples. *For more details, please refer to the PDF document or feel free to contact us.

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[Case of EBSD] Comparison of two brass materials

[Case of EBSD] Comparison of two brass materials

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[Analysis Example by EBSD] Chip

[Analysis Example by EBSD] Chip

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[Example of analysis using EBSD] Screw

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[Example of analysis using EBSD] Pipe

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[Example of analysis using EBSD] Via

[Example of analysis using EBSD] Via

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[Example of Analysis by EBSD] High Melting Point Solder

[Example of Analysis by EBSD] High Melting Point Solder

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Example of analysis using EBSD: steel plate

Example of analysis using EBSD: steel plate

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Crystal analysis by EBSD BGA

Crystal analysis by EBSD BGA

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Crystal analysis by EBSD: Intermetallic compounds in solder joints

Crystal analysis by EBSD: Intermetallic compounds in solder joints

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EBSD analysis

EBSD analysis

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Crystal analysis of Cu using the EBSD method.

Crystal analysis of Cu using the EBSD method.

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Example of analysis using the EBSD method

Example of analysis using the EBSD method

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EBSD analysis of flexible printed circuits (FPC)

EBSD analysis of flexible printed circuits (FPC)

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Example of analysis using EBSD (ceramics)

Example of analysis using EBSD (ceramics)

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[Data] Whisker Analysis by EBSD

[Data] Whisker Analysis by EBSD

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Example of analysis using EBSD: crab claw

Example of analysis using EBSD: crab claw

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[Example of analysis using EBSD] Silicon wafer

[Example of analysis using EBSD] Silicon wafer

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Crystal analysis by EBSD: Aluminum weld joint (spot welding)

Crystal analysis by EBSD: Aluminum weld joint (spot welding)

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

Example of analysis of compounds at the interface between SAC solder and Ni pads.

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Example of analysis of compounds at the SAC solder and Ni pad interface.

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We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

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Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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