Introducing a case study analyzing whiskers that occurred on the lead terminals of an IC package!
This document introduces a case study on whiskers that occurred on the lead terminals of IC packages, where cross-sections were created through mechanical polishing, followed by SEM observation and EBSD analysis. It includes surface SEM images of the IC package as well as cross-sectional SEM images. It is evident that the crystal grains and grain boundaries measured by the EBSD method are consistent. We encourage you to read it. 【Published Cases】 ■Observation/Cross-section Preparation ■Analysis by EBSD *For more details, please refer to the PDF document or feel free to contact us.
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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.