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  6. Example of analysis using the EBSD method

Example of analysis using the EBSD method

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last updated:Jun 26, 2025

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We will introduce an example of the analysis of EBSD patterns (Kikuchi patterns) at gold wire bond joints.

The EBSD (Electron Backscatter Diffraction) method obtains orientation information of individual crystals from the electron diffraction patterns generated by electron beam irradiation and maps this information. It is a technique used to investigate not only crystal orientation (texture) but also material microstructural states such as grain distribution and stress-strain as quantitative and statistical data. For example, when the sample is tilted significantly in a SEM and the electron beam is irradiated, if the sample is crystalline, electron diffraction occurs within the sample. By indexing the resulting pattern, it becomes possible to determine the crystal orientation at that point. By observing the differences in crystal orientation, it is possible to infer the residual stress within the crystal grains. 【Features】 ■ Obtains and maps orientation information of individual crystals ■ Investigates material microstructural states such as crystal orientation, grain distribution, and stress-strain ■ Allows inference of residual stress within crystal grains by observing differences in crystal orientation *For more details, please refer to the PDF document or feel free to contact us.

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Example of analysis using the EBSD method

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【Gold Wire Bond Joint Analysis Example】 ■ Inverse Pole Figure Orientation Map (IPF Map) ■ Crystal Orientation Map Based on Inverse Pole Figure ■ Grain Reference Orientation Deviation: GROD Map ■ Map of Crystal Orientation Differences within Grains *For more details, please refer to the PDF document or feel free to contact us.

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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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Regarding the bonding interface of Cu wire bonding.

Regarding the bonding interface of Cu wire bonding.

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[Information] Regarding the bonding interface of Cu wire bonding.

[Information] Regarding the bonding interface of Cu wire bonding.

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Example of analysis using the EBSD method

Example of analysis using the EBSD method

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Crystal analysis of Cu using the EBSD method.

Crystal analysis of Cu using the EBSD method.

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[Example of analysis using EBSD] Screw

[Example of analysis using EBSD] Screw

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Crystal analysis by EBSD BGA

Crystal analysis by EBSD BGA

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Example of analysis using EBSD: steel plate

Example of analysis using EBSD: steel plate

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EBSD analysis

EBSD analysis

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Crystal analysis by EBSD: Intermetallic compounds in solder joints

Crystal analysis by EBSD: Intermetallic compounds in solder joints

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[Example of analysis using EBSD] Pipe

[Example of analysis using EBSD] Pipe

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[Example of analysis using EBSD] Via

[Example of analysis using EBSD] Via

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[Example of Analysis by EBSD] High Melting Point Solder

[Example of Analysis by EBSD] High Melting Point Solder

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[Analysis Example by EBSD] Chip

[Analysis Example by EBSD] Chip

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Example of analysis using EBSD (whisker)

Example of analysis using EBSD (whisker)

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Crystal analysis by EBSD: Aluminum weld joint (spot welding)

Crystal analysis by EBSD: Aluminum weld joint (spot welding)

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[Example of analysis using EBSD] Silicon wafer

[Example of analysis using EBSD] Silicon wafer

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[Case of EBSD] Comparison of two brass materials

[Case of EBSD] Comparison of two brass materials

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

Example of analysis of compounds at the interface between SAC solder and Ni pads.

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Example of analysis of compounds at the SAC solder and Ni pad interface.

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We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface of NiP pads and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX shows the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is a technique that analyzes based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be possible to analyze using crystallographic data for Ni3Sn4 and Cu6Sn5 as substitutes.

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Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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