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  6. Analysis of the assembly joints of the implemented components

Analysis of the assembly joints of the implemented components

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last updated:Jun 26, 2025

アイテス
アイテス
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By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

    Contract AnalysisContract measurementOther contract services
実装部品接合部の解析.png

Analysis of the assembly joints of the implemented components

実装部品接合部の解析.png
実装部品接合部の解析.png
  • Surface mount electronic component cross-section polishing service
  • Special site - Product/service details - https://pr.mono.ipros.com/ites/product/

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basic information

■Mechanical polishing of the substrate bonding area + Chemical etching + Ion milling Observation using optical microscope and SEM ■Cross-section creation using FIB Observation using SEM

Price information

We will provide a quote as needed based on the content.

Delivery Time

Please contact us for details

※It varies depending on the content (expedited response available).

Applications/Examples of results

- Cross-section of lead-free soldered components observed under an optical microscope - SEM and FIB observation of the joint cross-section * Confirmation of intermetallic compounds at the joint interface * Observation of metal crystal grains

catalog(24)

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Aites Device List

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Analysis of electronic components and materials using TEM.

Analysis of electronic components and materials using TEM.

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Analysis of the assembly joints of the implemented components

Analysis of the assembly joints of the implemented components

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Cross beam FIB cross-sectional observation

Cross beam FIB cross-sectional observation

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Ink immersion test for implementation parts (dye and pry)

Ink immersion test for implementation parts (dye and pry)

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Evaluation of BGA/CSP solder

Evaluation of BGA/CSP solder

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Observation of Pb-free solder cross-section after reliability testing.

Observation of Pb-free solder cross-section after reliability testing.

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Thermal shock test

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Liquid tank thermal shock test

Liquid tank thermal shock test

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3D construction through mechanical grinding

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Solder Heat Resistance Test (SMD)

Solder Heat Resistance Test (SMD)

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Cross-sectional observation of substrate-mounted components.

Cross-sectional observation of substrate-mounted components.

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Cross-sectional observation of substrate-mounted components (1) to (6)

Cross-sectional observation of substrate-mounted components (1) to (6)

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Examples of semiconductor observation through mechanical polishing.

Examples of semiconductor observation through mechanical polishing.

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CP processing device Arblade5000_ Wide Area Cross-section Milling

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

Example of analysis of compounds at the interface between SAC solder and Ni pads.

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Evaluation of various implementation boards

Evaluation of various implementation boards

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Strain measurement of power module package resin.

Strain measurement of power module package resin.

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About the curing temperature of epoxy resin free of hazardous substances.

About the curing temperature of epoxy resin free of hazardous substances.

OTHER
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Cryogenic ion milling cross-section processing example (rubber products)

Cryogenic ion milling cross-section processing example (rubber products)

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News about this product(10)

Cryogenic ion milling cross-section processing example (rubber products)

  • Product news

We will introduce a case where cross-sections were created and observed by method regarding the adhesive parts of the tires of pull-back cars. When conducting SEM observations of the created cross-sections, fillers present inside the rubber were confirmed. It was found that the dispersion state of the fillers and the condition of the adhesive interface were not clear with fracture by liquid nitrogen or mechanical polishing. In contrast, the cross-sections created by cryo ion milling allow for clear observation of the dispersion state of the fillers contained within the rubber and the condition of the adhesive interface with the plastic substrate.

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About the curing temperature of epoxy resin free from hazardous substances.

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We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying the heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C.

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Strain measurement of power module package resin.

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We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in the mounted state on a circuit board and in the unmounted state. In the mounted module, a slight delay in temperature change was observed, and correspondingly, the change in strain also appeared to be delayed. This is believed to be due to the slower transfer of heat to the module when it is mounted. At Aites, we conduct temperature cycle tests and temperature-humidity cycle tests, during which we can simultaneously measure the strain occurring in the mounted components. Please feel free to consult with us.

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Evaluation of various implementation substrates

  • Company news

At Aites Co., Ltd., we provide a wide range of technical services for evaluation tests of printed circuit boards (mounted boards) equipped with electronic components. We conduct reliability tests, solder joint observations, whisker observations, and cross-sectional observations. We have IPC-A-610 certified IPC specialists on staff who can assist with observations in accordance with international standards, consultations, and various observation-related concerns. Additionally, we offer services such as X-ray observations, appearance inspections, and shape measurements, so please feel free to consult with us when needed.

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アイテス

アイテス

Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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