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  4. About the curing temperature of epoxy resin free from hazardous substances.
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  • May 08, 2025
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May 08, 2025

About the curing temperature of epoxy resin free from hazardous substances.

アイテス アイテス
We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying the heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C.
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劇物フリーのエポキシ樹脂硬化温度について20250425.pdf[0]

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temperature profile.png

About the curing temperature of epoxy resin free from hazardous substances.

We conducted measurements to reconfirm the temperature at which heat is generated during hardening!

We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat prevention treatment for resin embedding. Without this treatment, the temperature can rise to 138°C during curing. However, with the heat prevention treatment applied, we were able to keep the heat generation during curing to within 30°C, even with a large amount of resin. 【Measurement Results】 ■ Without heat prevention treatment for a large amount of resin (large container) - Heat generation reached up to 138°C during curing. ■ With heat prevention treatment for a large amount of resin (large container) - Heat generation during curing was kept within 30°C. *For more details, please download the PDF or feel free to contact us.

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Analysis of the assembly joints of the implemented components

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

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  • Contract measurement
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Total support service for cross-sectional grinding, processing, observation, and analysis.

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

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  • Analysis Services

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Cross-sectional observation pre-treatment (sample cutting and resin embedding)

We will introduce the pre-treatment for cross-sectional observation using devices for sample cutting, such as band saws!

We would like to introduce the sample preparation (sample cutting and resin embedding) for cross-sectional observation conducted by Aites Co., Ltd. We use cutting equipment suitable for cutting large substrates and thick components, such as the band saw "HOZAN K-100" and the IsoMet "Buehler Low Speed Saw." With the "HOZAN K-100," samples up to approximately X150mm, Y230mm, and Z70mm in size can be cut. Additionally, after cutting, the samples are embedded in epoxy resin or similar materials, but it is also possible to embed in resin before cutting. 【Product Lineup】 ■ Band Saw ■ IsoMet ■ Multifunctional Diamond Wire Saw *For more details, please refer to the PDF document or feel free to contact us.

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Cross-sectional polishing service for implementation parts and electronic components.

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

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Regarding the curing temperature of epoxy resin during sample encapsulation.

Even with larger-sized implementation boards, resin embedding is possible without cutting before embedding! We will introduce cases with and without heat generation prevention treatment.

Epoxy resin is transparent, has a low shrinkage rate, and is often used for making cross-sections. However, since it is a thermosetting resin, it generates heat during the curing process. The temperature of heat generation varies depending on the amount used and the mixing ratio of the main agent and hardener. When embedding large samples such as printed circuit boards and touch panels, the epoxy resin can generate enough heat to deform the sample substrate. Therefore, we investigated how much heat is actually generated during curing. For more details, please refer to the PDF download below. 【Overview】 ■ Temperature profile acquisition - Without heat prevention treatment for a large amount of resin (large container) ■ Temperature profile acquisition - With heat prevention treatment for a large amount of resin (large container) ■ Resin embedding is possible even for larger printed circuit boards without cutting before embedding. *For more details, please refer to the PDF document or feel free to contact us.

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Measurement of solder crack rate by cross-sectional observation.

Calculating the crack rate of ball joints and implementing it according to customer specifications!

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within the allowable standards. The evaluation standards after the solder durability test can be individually defined based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

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Introduction to Cross-Section Processing and Observation Methods

Mechanical grinding allows for a wide range of processing and observation! We will propose appropriate processing and observation methods or combinations.

We will introduce sample processing using mechanical polishing and mechanical polishing combined with ion milling treatment. Mechanical polishing is a common and long-established method for creating cross-sections, allowing for a wide range of cross-sectional production. Additionally, by combining it with ion milling treatment, it is possible to create observation surfaces comparable to those produced by CP processing. At Aites, we propose appropriate processing and observation methods or combinations based on our accumulated know-how. Please feel free to contact us for consultations or inquiries. 【Features】 ■ Mechanical polishing allows for extensive processing and observation. ■ By repeating mechanical polishing and imaging, three-dimensional observation is possible. ■ Observation at any desired location can be performed based on the constructed 3D image. ■ After mechanical polishing, depending on the sample, observation comparable to that of CP processed samples is possible. *For more details, please refer to the PDF materials or feel free to contact us.

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Related catalog(8)

Analysis of the assembly joints of the implemented components

Analysis of the assembly joints of the implemented components

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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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Cross-sectional observation pre-treatment (sample cutting and resin embedding)

Cross-sectional observation pre-treatment (sample cutting and resin embedding)

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Cross-sectional polishing service for implementation parts and electronic components.

Cross-sectional polishing service for implementation parts and electronic components.

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Regarding the curing temperature of epoxy resin during sample encapsulation.

Regarding the curing temperature of epoxy resin during sample encapsulation.

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Measurement of solder crack rate by cross-sectional observation.

Measurement of solder crack rate by cross-sectional observation.

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Introduction to Section Processing and Observation Methods

Introduction to Section Processing and Observation Methods

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About the curing temperature of epoxy resin free of hazardous substances.

About the curing temperature of epoxy resin free of hazardous substances.

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アイテス
Electronic Components and Semiconductors
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Human Body Day 2025 Event Report - Nack Image Technology

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On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

Mar 20, 2026

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Tokai Area Electrical and Electronic Web Technology Seminar Invitation

The start date for the 2026 "Tokai Area Electrical and Electronic WEB Technology Seminar" has been decided!

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The date for the "Tokai Area Electrical and Electronic WEB Technology Seminar" for the 2026 fiscal year has been decided. Registration has started, so if you are interested, please apply. Multiple participants from one company are allowed, so please make use of this opportunity to acquire basic knowledge. 【April】Basic Knowledge of Resistors 【May】Technical Course on Capacitors 【June】Basics of Motors and How to Choose the Optimal Driver 【July】Fundamentals of IC Socket and Connector Selection 【September】Basics of Magnets 【October】Failure Phenomena of Chip Resistors and Their Countermeasures 【November】Temperature Protection Design Using Thermal Fuses

Mar 20, 2026

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New Product Hand Magnet "YokeLite-100V"

Handmagna "YokeLite-100V" sales start - December 25, 2025

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  • PRODUCT

NDT Mart & Rental Co., Ltd. began selling its new product, the handheld magnet "YokeLite-100V," on December 25, 2025. ◆ Handheld Magnet "YokeLite-100V" The YokeLite-100V is an AC handheld magnet (gap-type magnetizer) used for magnetic particle testing (MT). With a compact design weighing approximately 2.4 kg, it is easy to handle and allows for efficient non-destructive testing work on-site. It generates a powerful alternating magnetic field, supporting the detection of defects such as cracks in welds and on metal surfaces. It features a variable yoke structure, enabling flexible adaptation to various inspection targets, including curved surfaces, corners, and fillet welds. It ensures a lifting power of over 4.5 kg, providing sufficient magnetization capability required for magnetic particle testing. Additionally, by equipping optional UV lights or white lights, it can accommodate a wide range of inspection methods, including fluorescent magnetic particle testing and visual inspections, offering excellent cost performance. This handheld magnet is useful for defect inspection and quality control in the fields of manufacturing, plant equipment, and welding inspection. It combines lightweight design with high inspection performance, contributing to improved work efficiency.

Mar 20, 2026

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New Product: Electromagnetic Ultrasonic Thickness Gauge 'EMAT WIFI'

Started selling the electromagnetic ultrasonic thickness gauge 'EMAT WIFI' - January 19, 2026

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NDT Mart & Rental Co., Ltd. began selling its new electromagnetic ultrasonic thickness gauge, 'EMAT WIFI', on January 19, 2026. ◆ Electromagnetic Ultrasonic Thickness Gauge 'EMAT WIFI' The 'EMAT WIFI' is a thickness gauge that uses the electromagnetic ultrasonic (EMAT) method, which does not require a couplant (contact medium). Unlike conventional ultrasonic thickness gauges (UT), there is no need to apply a couplant; thickness measurements can be taken simply by placing the probe on the measurement target, making it ideal for beginners and screening in large-scale sites. It can measure materials with paint, scale, thick linings, and slight surface roughness, significantly reducing the hassle of pre-treatment. Additionally, it is equipped with WiFi communication capabilities, allowing for the confirmation and management of measurement data and waveforms in conjunction with smartphones and tablets. This facilitates smooth sharing of measurement results and data management on-site. It is optimal for measuring wall thickness and conducting corrosion inspections of plant equipment, piping, tanks, and steel structures. It contributes to the efficiency and reliability of thickness measurements in the field of non-destructive testing (NDT), such as maintenance inspections and equipment diagnostics.

Mar 20, 2026

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New Product: Dual Thickness Gauge 'CT3500'

Sales of the dual thickness gauge "CT3500" compatible with a maximum of 3.5mm will begin on January 28, 2026.

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NDT Mart & Rental Co., Ltd. began sales of its new dual thickness gauge, the 'CT3500', on January 28, 2026. ◆ Dual Thickness Gauge 'CT3500' The 'CT3500' is a portable thickness gauge that supports a wide range of coating measurements from thin films to thick films. It employs a dual measurement method using electromagnetic and eddy current techniques, allowing for automatic differentiation between ferrous and non-ferrous substrates to measure coating thickness. The measurement range accommodates up to 3,500μm, making it suitable for measuring coatings from general painting to heavy anti-corrosion coatings and linings. With a measurement speed of approximately 0.2 seconds, it allows for efficient measurements even in inspection tasks that require multiple points. It is not only compact and easy to carry, but its display features an inclined design that is easy to see from both above and the front. Additionally, the upside-down display and background color (white/black) switching enhance visibility in dark, narrow, and outdoor environments, making it suitable for quality control within factories as well as for equipment inspections and painting checks in outdoor settings. It can be utilized for a wide range of applications, including painting management of bridges and steel structures, anti-corrosion coating measurements for pipes and tanks, and quality control in manufacturing sites. The 'CT3500' is a high-performance portable thickness gauge that provides stable measurements from thin to thick films, designed for field use.

Mar 20, 2026

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