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  3. アイテス
  4. About the curing temperature of epoxy resin free from hazardous substances.
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  • May 08, 2025
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May 08, 2025

About the curing temperature of epoxy resin free from hazardous substances.

アイテス アイテス
We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying the heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C.
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劇物フリーのエポキシ樹脂硬化温度について20250425.pdf[0]

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temperature profile.png

About the curing temperature of epoxy resin free from hazardous substances.

We conducted measurements to reconfirm the temperature at which heat is generated during hardening!

We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat prevention treatment for resin embedding. Without this treatment, the temperature can rise to 138°C during curing. However, with the heat prevention treatment applied, we were able to keep the heat generation during curing to within 30°C, even with a large amount of resin. 【Measurement Results】 ■ Without heat prevention treatment for a large amount of resin (large container) - Heat generation reached up to 138°C during curing. ■ With heat prevention treatment for a large amount of resin (large container) - Heat generation during curing was kept within 30°C. *For more details, please download the PDF or feel free to contact us.

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Analysis of the assembly joints of the implemented components

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

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Total support service for cross-sectional grinding, processing, observation, and analysis.

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Analytical Equipment and Devices
  • Analysis Services

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Cross-sectional observation pre-treatment (sample cutting and resin embedding)

We will introduce the pre-treatment for cross-sectional observation using devices for sample cutting, such as band saws!

We would like to introduce the sample preparation (sample cutting and resin embedding) for cross-sectional observation conducted by Aites Co., Ltd. We use cutting equipment suitable for cutting large substrates and thick components, such as the band saw "HOZAN K-100" and the IsoMet "Buehler Low Speed Saw." With the "HOZAN K-100," samples up to approximately X150mm, Y230mm, and Z70mm in size can be cut. Additionally, after cutting, the samples are embedded in epoxy resin or similar materials, but it is also possible to embed in resin before cutting. 【Product Lineup】 ■ Band Saw ■ IsoMet ■ Multifunctional Diamond Wire Saw *For more details, please refer to the PDF document or feel free to contact us.

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Cross-sectional polishing service for implementation parts and electronic components.

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

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Regarding the curing temperature of epoxy resin during sample encapsulation.

Even with larger-sized implementation boards, resin embedding is possible without cutting before embedding! We will introduce cases with and without heat generation prevention treatment.

Epoxy resin is transparent, has a low shrinkage rate, and is often used for making cross-sections. However, since it is a thermosetting resin, it generates heat during the curing process. The temperature of heat generation varies depending on the amount used and the mixing ratio of the main agent and hardener. When embedding large samples such as printed circuit boards and touch panels, the epoxy resin can generate enough heat to deform the sample substrate. Therefore, we investigated how much heat is actually generated during curing. For more details, please refer to the PDF download below. 【Overview】 ■ Temperature profile acquisition - Without heat prevention treatment for a large amount of resin (large container) ■ Temperature profile acquisition - With heat prevention treatment for a large amount of resin (large container) ■ Resin embedding is possible even for larger printed circuit boards without cutting before embedding. *For more details, please refer to the PDF document or feel free to contact us.

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Measurement of solder crack rate by cross-sectional observation.

Calculating the crack rate of ball joints and implementing it according to customer specifications!

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within the allowable standards. The evaluation standards after the solder durability test can be individually defined based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

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Introduction to Cross-Section Processing and Observation Methods

Mechanical grinding allows for a wide range of processing and observation! We will propose appropriate processing and observation methods or combinations.

We will introduce sample processing using mechanical polishing and mechanical polishing combined with ion milling treatment. Mechanical polishing is a common and long-established method for creating cross-sections, allowing for a wide range of cross-sectional production. Additionally, by combining it with ion milling treatment, it is possible to create observation surfaces comparable to those produced by CP processing. At Aites, we propose appropriate processing and observation methods or combinations based on our accumulated know-how. Please feel free to contact us for consultations or inquiries. 【Features】 ■ Mechanical polishing allows for extensive processing and observation. ■ By repeating mechanical polishing and imaging, three-dimensional observation is possible. ■ Observation at any desired location can be performed based on the constructed 3D image. ■ After mechanical polishing, depending on the sample, observation comparable to that of CP processed samples is possible. *For more details, please refer to the PDF materials or feel free to contact us.

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Related catalog(8)

Analysis of the assembly joints of the implemented components

Analysis of the assembly joints of the implemented components

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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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Cross-sectional observation pre-treatment (sample cutting and resin embedding)

Cross-sectional observation pre-treatment (sample cutting and resin embedding)

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Cross-sectional polishing service for implementation parts and electronic components.

Cross-sectional polishing service for implementation parts and electronic components.

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Regarding the curing temperature of epoxy resin during sample encapsulation.

Regarding the curing temperature of epoxy resin during sample encapsulation.

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Measurement of solder crack rate by cross-sectional observation.

Measurement of solder crack rate by cross-sectional observation.

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Introduction to Section Processing and Observation Methods

Introduction to Section Processing and Observation Methods

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About the curing temperature of epoxy resin free of hazardous substances.

About the curing temperature of epoxy resin free of hazardous substances.

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アイテス
Electronic Components and Semiconductors
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Fukuda's leak test, leak inspection, leak detection, leak test, integrity test.

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  • PRODUCT

Fukuda Co., Ltd. has been pursuing leak detection for 60 years and is committed to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing properties. We will propose the appropriate testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Jan 23, 2026

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[Opening on January 6, 2026] New service launched to search for exhibits nationwide.

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We have launched a "Display Item Search Page" that allows you to search for unit houses currently on display at exhibition halls nationwide, which was made available on January 6, 2026. There are over 800 items listed on the website. You can filter by area, price range, size, purpose, product type, color, and more. You can also check exterior and interior photos, prices, facilities, and drawings/specifications online. If you're interested in a display item, you can directly inquire, make a reservation to visit, or consult via LINE. This is a convenient service that allows you to efficiently progress from comparison to detailed consideration. Please take a look!

Jan 23, 2026

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Publication of a paper in Oxford Open Materials Science

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  • OTHER

A co-authored paper by Shin Otsuki from the Data Science Department and another author has been published in Oxford Open Materials Science. 【Paper Summary】 Title: The Exploration of Enhanced Methods in Data Science and Applications in Materials Science Authors: Raymond Wu, Shin Otsuki

Jan 23, 2026

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[New Product] Announcement of the High Brightness LED Lighting Box LLBLM-A Series

  • NEW
  • PRODUCT

"With high-precision dimming settings of 256/1000 gradations, you can achieve your desired results." The new 1-channel dedicated model LLBLM-A maximizes the performance of high-brightness LEDs. It offers high light stability through constant current control and flexibly accommodates a wide range of inspection and lighting applications with three types of interfaces: parallel, RS232C, and LAN. In addition to intuitive operation via the front panel, it supports high-precision dimming with 256/1000 gradations (256 gradations in parallel mode). The available emission colors are G (green) and B (blue). This new model balances stable light output with ease of use. For more details, please feel free to contact us.

Jan 23, 2026

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All participants chant for safety.

The Winter Safety Conference for the 7th year of Reiwa was held.

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Last month, we held a winter safety conference organized by our company. We have compiled the details and atmosphere of the day, as well as information on winter labor accidents, into a PDF. We would appreciate it if you could take a moment to read it.

Jan 23, 2026

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