About the curing temperature of epoxy resin free from hazardous substances.

We conducted measurements to reconfirm the temperature at which heat is generated during hardening!

We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat prevention treatment for resin embedding. Without this treatment, the temperature can rise to 138°C during curing. However, with the heat prevention treatment applied, we were able to keep the heat generation during curing to within 30°C, even with a large amount of resin. 【Measurement Results】 ■ Without heat prevention treatment for a large amount of resin (large container) - Heat generation reached up to 138°C during curing. ■ With heat prevention treatment for a large amount of resin (large container) - Heat generation during curing was kept within 30°C. *For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

• Contract Analysis
• Contract measurement
• Other contract services

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake contract processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observation and analysis of the produced cross-sections, providing contract analysis for defect analysis and quality evaluation. 【Service List】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices
• Analysis Services

We will introduce the pre-treatment for cross-sectional observation using devices for sample cutting, such as band saws!

We would like to introduce the sample preparation (sample cutting and resin embedding) for cross-sectional observation conducted by Aites Co., Ltd. We use cutting equipment suitable for cutting large substrates and thick components, such as the band saw "HOZAN K-100" and the IsoMet "Buehler Low Speed Saw." With the "HOZAN K-100," samples up to approximately X150mm, Y230mm, and Z70mm in size can be cut. Additionally, after cutting, the samples are embedded in epoxy resin or similar materials, but it is also possible to embed in resin before cutting. 【Product Lineup】 ■ Band Saw ■ IsoMet ■ Multifunctional Diamond Wire Saw *For more details, please refer to the PDF document or feel free to contact us.

• others

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implemented components and electronic parts." To quickly provide suitable cross-section samples for the observation of various components, we carefully polish each part by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly providing suitable cross-section samples for the observation of various components ■ Carefully polishing each part by hand, using an efficient process without waste *For more details, please refer to the PDF document or feel free to contact us.

• Processing Contract
• Surface treatment contract service
• Other contract services

Even with larger-sized implementation boards, resin embedding is possible without cutting before embedding! We will introduce cases with and without heat generation prevention treatment.

Epoxy resin is transparent, has a low shrinkage rate, and is often used for making cross-sections. However, since it is a thermosetting resin, it generates heat during the curing process. The temperature of heat generation varies depending on the amount used and the mixing ratio of the main agent and hardener. When embedding large samples such as printed circuit boards and touch panels, the epoxy resin can generate enough heat to deform the sample substrate. Therefore, we investigated how much heat is actually generated during curing. For more details, please refer to the PDF download below. 【Overview】 ■ Temperature profile acquisition - Without heat prevention treatment for a large amount of resin (large container) ■ Temperature profile acquisition - With heat prevention treatment for a large amount of resin (large container) ■ Resin embedding is possible even for larger printed circuit boards without cutting before embedding. *For more details, please refer to the PDF document or feel free to contact us.

• Analysis Services
• Other contract services

Calculating the crack rate of ball joints and implementing it according to customer specifications!

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within the allowable standards. The evaluation standards after the solder durability test can be individually defined based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

• Contract measurement

Mechanical grinding allows for a wide range of processing and observation! We will propose appropriate processing and observation methods or combinations.

We will introduce sample processing using mechanical polishing and mechanical polishing combined with ion milling treatment. Mechanical polishing is a common and long-established method for creating cross-sections, allowing for a wide range of cross-sectional production. Additionally, by combining it with ion milling treatment, it is possible to create observation surfaces comparable to those produced by CP processing. At Aites, we propose appropriate processing and observation methods or combinations based on our accumulated know-how. Please feel free to contact us for consultations or inquiries. 【Features】 ■ Mechanical polishing allows for extensive processing and observation. ■ By repeating mechanical polishing and imaging, three-dimensional observation is possible. ■ Observation at any desired location can be performed based on the constructed 3D image. ■ After mechanical polishing, depending on the sample, observation comparable to that of CP processed samples is possible. *For more details, please refer to the PDF materials or feel free to contact us.

• Analysis Services
• Other contract services

We exhibited a booth at the "4th Annual Meeting of the Japanese Society for Antibody Research" held at Omiya Sonic City from December 1 (Monday) to December 3 (Wednesday). Thank you very much to everyone who visited our booth during the event. Thanks to your support, we were able to successfully conclude the meeting. If you have any questions regarding the products you viewed, please feel free to reach out to us. We will respond to inquiries received during the event in due course. We appreciate your continued support of Higuchi Shokai. ▼Exhibited Products - Various assembly parts (bags, bottles, sampling, etc.) - Depth filters (post-culture filtration)

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Do you have any concerns or requests regarding wired bed exit sensors? × Tangling and tripping of wired cables × Cable disconnection or damage × Worry about forgetting to turn on the switch after temporarily stopping the sensor. × Want to be notified of bed exit even from a location away from the nurse call outlet. Such concerns can be resolved simply by connecting to a wireless set linked to the nurse call system! Our nurse call linked wireless set allows you to connect bed exit sensors like "Ugo-kun," "Foldable Thin Matta-kun," "Ayumi-chan," and "Just Place Pole-kun" to transmitters and receivers, reducing wiring around the bed, alleviating concerns about tripping and falling due to cables, and contributing to a tidier work environment. Furthermore, it enables the use of bed exit sensors even from locations away from the nurse call outlet, allowing for more flexible equipment placement.

The pinhole inspection for packaging engineering is fully automated, eliminating packaging defects based on certain quality standards. The judgment results and operational status can be managed via a monitor screen. - Quantitative management of quality standards for the pinhole inspection process - Ensuring the quality of the product's shelf life - Establishing evaluation criteria for the manufacturing process, achieving quantitative quality assurance - Slim and space-saving design that can be connected to existing production lines - Quick changeover for product variety switching can be handled in a short time by exchanging chambers - Fully domestically produced, allowing for rapid maintenance and troubleshooting - Example target works: pillow packaging, packaged rice (packaged cooked rice), etc. *Please consult us regarding the use of this product for pharmaceuticals.