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  6. Introduction to Cross-Section Processing and Observation Methods

Introduction to Cross-Section Processing and Observation Methods

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last updated:Jun 26, 2025

アイテス
アイテス
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Mechanical grinding allows for a wide range of processing and observation! We will propose appropriate processing and observation methods or combinations.

We will introduce sample processing using mechanical polishing and mechanical polishing combined with ion milling treatment. Mechanical polishing is a common and long-established method for creating cross-sections, allowing for a wide range of cross-sectional production. Additionally, by combining it with ion milling treatment, it is possible to create observation surfaces comparable to those produced by CP processing. At Aites, we propose appropriate processing and observation methods or combinations based on our accumulated know-how. Please feel free to contact us for consultations or inquiries. 【Features】 ■ Mechanical polishing allows for extensive processing and observation. ■ By repeating mechanical polishing and imaging, three-dimensional observation is possible. ■ Observation at any desired location can be performed based on the constructed 3D image. ■ After mechanical polishing, depending on the sample, observation comparable to that of CP processed samples is possible. *For more details, please refer to the PDF materials or feel free to contact us.

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X-sectional

Introduction to Cross-Section Processing and Observation Methods

X-sectional observation.png
X-sectional observation.png
  • Related Link - https://www.ites.co.jp/section/index.html
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catalog(8)

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Introduction to Section Processing and Observation Methods

Introduction to Section Processing and Observation Methods

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3D construction through mechanical grinding

3D construction through mechanical grinding

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Cross-sectional observation of large samples (expansion valve)

Cross-sectional observation of large samples (expansion valve)

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Total support service for cross-section grinding, processing, observation, and analysis.

Total support service for cross-section grinding, processing, observation, and analysis.

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[Data] Cross-section production method

[Data] Cross-section production method

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Cross-sectional polishing service for implementation parts and electronic components.

Cross-sectional polishing service for implementation parts and electronic components.

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CP processing device Arblade5000_ Wide Area Cross-section Milling

CP processing device Arblade5000_ Wide Area Cross-section Milling

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About the curing temperature of epoxy resin free of hazardous substances.

About the curing temperature of epoxy resin free of hazardous substances.

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About the curing temperature of epoxy resin free from hazardous substances.

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We conducted measurements to reconfirm the temperature of heat generation during curing, following the change to a non-toxic epoxy resin. When using a large amount of resin, we apply heat generation prevention treatment for resin embedding. Without this treatment, the temperature can rise up to 138°C during curing. However, by applying the heat generation prevention treatment even with a large amount of resin, we were able to keep the heat generation during curing within 30°C.

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Information about the CP processing device Arblade5000_Wide Area Cross-section Milling

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We offer the "CP Processing Device Arblade5000_Wide Area Cross-Section Milling." The "Arblade5000" enables extensive processing by combining a high milling rate with wide area cross-section milling capabilities. With the wide area cross-section milling holder, the cross-section milling width can be expanded up to 10mm, making it effective for electronic components that require wide area milling. 【Features】 ■ Approximately double the width of processing is possible ■ The previously localized observation range can be significantly expanded ■ Equipped with a cooling temperature adjustment function to control temperature rise caused by ion beam irradiation ■ The observable range is approximately 8mm

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アイテス

アイテス

Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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