Strain measurement of power module package resin.

Measuring the strain behavior of the sealing resin under thermal cycling using a strain gauge!

We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in a mounted state on a circuit board and in an unmounted state. In the mounted module, it was observed that the temperature change was slightly slower, and correspondingly, the change in strain was also slow. This is believed to be due to the delayed transfer of heat to the module when it is mounted. 【Test Overview】 ■ Strain Gauge Used - Foil strain gauge for composite materials: compatible linear expansion coefficient 1x10^-6, base 15x5mm ■ Test Conditions - Hold at -40℃ for 3 hours → 15℃/min → Hold at 80℃ for 3 hours * 5 cycles * For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

Support for the difficulties in the development and evaluation of components, devices, and materials related to semiconductor products.

【Testing, Evaluation, Analysis】 　●Reliability Testing 　　■Temperature Cycle Testing 　　■Thermal Shock Testing 　　■High-Temperature Storage Testing 　　■Highly Accelerated Life Testing 　　■Preconditioning 　　■Hot Oil Testing 　　■In-situ Continuous Measurement 　　■Ion Migration Testing 　　■Electromigration Testing 　　■Test Consulting 　●Evaluation Testing 　　■Bond Strength Testing: Pull/Shear Testing 　　■Mechanical Strength Testing: Vibration/Shock/Fall Testing/Compression Strength/Shear Strength 　　■ESD/Latch Up/CDM Testing 　　■Electrical Characteristic Measurement 　　■Salt Spray Testing 　●Analysis 　　■X-ray Transmission Observation 　　■Ultrasonic Microscope Observation 　　■Luminescence Analysis (EMS/IR-OBIRCH) 　　■Scanning Electron Microscope (SEM) 　　■Transmission Electron Microscope (TEM) 　　■Surface Contamination Analysis (TOF-SIMS) 　　■Foreign Substance Analysis (FT-IR)

• Other contract services

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

• Contract Analysis
• Contract measurement
• Other contract services

Introducing the perspectives from which analysis and analytical techniques should be advanced!

Our company supports customers in solving their challenges and issues not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point for problem-solving and provides assistance in unraveling issues for our customers. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other analyses

Two high-power constant temperature and humidity chambers have been introduced! Ideal for temperature cycle tests and temperature and humidity cycle tests for automotive parts and more.

At AITES Co., Ltd., we offer "environmental testing in a high-power constant temperature and humidity chamber." We can achieve a constant temperature change of up to 15°C/min (-45 to ±155°C). Temperature cycle tests can be conducted by controlling the temperature gradient. Additionally, the temperature control range is wider than that of typical constant temperature and humidity chambers, allowing control at 95°C. 【Features】 ■ Two high-power constant temperature and humidity chambers introduced ■ Constant temperature change of up to 15°C/min (-45 to ±155°C) possible ■ Temperature cycle tests can be conducted by controlling the temperature gradient ■ Wider temperature control range than typical constant temperature and humidity chambers ■ Controllable at 95°C *For more details, please refer to the PDF materials or feel free to contact us.

• Contract Analysis
• Contract measurement
• Contract Inspection

Contracting power cycle tests using a power cycle testing device! We will cooperate in improving quality along with failure analysis and assessment.

At Aites Co., Ltd., we offer contract power cycle testing using Siemens (Mentor) power cycle testing equipment. We can also handle the creation of various jigs necessary for the tests. Additionally, we accommodate various observations and measurements of power devices. We can capture changes before and after tests such as power cycle testing. 【Features】 ■ We can handle the creation of various jigs necessary for the tests. ■ We accommodate various observations and measurements of power devices. ■ We can capture changes before and after tests such as power cycle testing. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Contract measurement
• Contract Inspection

Applicable to change observation, with support for additional analysis! We evaluate the subject in a time series and non-destructive manner.

During reliability testing, the samples change continuously. Do you have any questions such as "At what point did the crack occur?", "How does the degradation progress?", or "How much has it changed from the initial state?" By combining this with reliability testing, we will evaluate the subject in a time-series and non-destructive manner. 【Features】 ■ Applicable for observing changes in whiskers, migration, pressure resistance, solder evaluation, chemical erosion tests, and aging products in the market ■ Environmental tests and observation frequency will be conducted according to customer requirements ■ Additional analyses such as electrical characteristics, SEM observation, elemental analysis, and cross-sectional observation are also available *For more details, please refer to the PDF document or feel free to contact us.

• Testing Equipment and Devices
• Other inspection equipment and devices
• Contract Inspection

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis regarding the malfunctioning part!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu office in 1993, we have cultivated our own unique analysis and evaluation techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 ■ OBIRCH analysis supports not only Si but also SiC and GaN devices ■ FIB processing is possible from either side ■ Visualization of the depletion layer formed at the PN junction ■ Elemental analysis such as EDS and EELS is also supported *For more details, please refer to the PDF document or feel free to contact us.

• Semiconductor inspection/test equipment
• Contract Analysis
• Analysis Services

It is also possible to estimate the relationship with molecular-level structures! Introducing the types of thermal analysis and the properties that can be understood.

When heat is applied to materials, various properties change. Thermal analysis is suitable for investigating such properties. Depending on the changes in the properties we want to observe, we use different devices and combine them as necessary. By understanding the various changes that occur when materials are subjected to heat, we can gain insights into how they will behave in practical applications. When combined with other chemical analyses, it is also possible to estimate the relationship with molecular-level structures. If you have any questions about the relationship between materials and heat, please feel free to consult us. 【Analysis Equipment (Excerpt)】 <DSC (Differential Scanning Calorimeter)> ■ Changes observed: Heat flow (exothermic/endothermic) ■ Properties that can be determined: Melting point (freezing point), glass transition, crystallization, specific heat capacity ■ Applicable materials: Plastics, rubber, metals ■ Analysis examples: Measurement of the curing degree of thermosetting resins, measurement of the transformation temperature of shape memory alloys *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices

Observing the behavior of strain in thermal shock testing! The test materials used are FR-1 and FR-4.

We would like to introduce the "Strain Measurement of Thermal Shock Testing" conducted by our company. A sample with a strain gauge attached was set up in the thermal shock testing device, and the wiring of the strain gauge was connected to an external data logger to record the strain data in real-time during the test. The strain behavior during the thermal shock test was observed for two types of copper-clad laminates, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4. [Test Conditions] ■ Temperature Cycle: -30°C to 120°C ■ Exposure Time at Each Temperature: 30 min ■ Test Materials - FR-1 Paper Phenolic (Double-sided board) - FR-4 Glass Epoxy (Double-sided board) ■ Strain Gauge: Foil strain gauge for printed circuit boards *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

We investigated the behavior of strain during moisture absorption and drying using a strain gauge!

We would like to introduce the results of our investigation into the behavior of strain during moisture absorption and drying using strain gauges. It was observed that the material expands when absorbing moisture and contracts back to its original state when drying, with the strain returning to the condition prior to moisture absorption. Regarding FR-1, it is presumed that it did not return to its original state due to changes in the chemical structure of the material caused by hydrolysis. 【Test Overview】 ■ 85℃ 50% ⇒ 85℃ 85% ⇒ 85℃ 50% ■ Test Materials ・FR-1 Paper Phenolic (single-sided board) ・FR-4 Glass Epoxy (single-sided board) ■ Strain Gauge ■ Foil Strain Gauge for Composite Materials *For more details, please download the PDF or feel free to contact us.

• Contract measurement

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

The "Mechanical Stitching Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact on the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

On November 6th (Thursday) to 7th (Friday), 2025, we held the "Human Body Day 2025" at the NAC Image Technology Akasaka Multi-Purpose Space. We have uploaded videos of the highlights from each company and the presentations that took place on the day to our website. We encourage you to take a look. ---[Report on Human Body Day 2025 is here]------------------- https://info.nacinc.jp/jintaiday2025-report ------------------------------------------------------------------------- On the day of the event, participants were able to experience a wide range of products in a hands-on session format, including motion capture, force plates, eye tracking, and human body analysis software. We received numerous comments from attendees expressing high satisfaction, saying, "It was great to gain various information all at once," which makes us very happy. NAC Image Technology will continue to provide "valuable products to our customers." We hope you will join us for our next event as well.

The date for the "Tokai Area Electrical and Electronic WEB Technology Seminar" for the 2026 fiscal year has been decided. Registration has started, so if you are interested, please apply. Multiple participants from one company are allowed, so please make use of this opportunity to acquire basic knowledge. 【April】Basic Knowledge of Resistors 【May】Technical Course on Capacitors 【June】Basics of Motors and How to Choose the Optimal Driver 【July】Fundamentals of IC Socket and Connector Selection 【September】Basics of Magnets 【October】Failure Phenomena of Chip Resistors and Their Countermeasures 【November】Temperature Protection Design Using Thermal Fuses

NDT Mart & Rental Co., Ltd. began selling its new electromagnetic ultrasonic thickness gauge, 'EMAT WIFI', on January 19, 2026. ◆ Electromagnetic Ultrasonic Thickness Gauge 'EMAT WIFI' The 'EMAT WIFI' is a thickness gauge that uses the electromagnetic ultrasonic (EMAT) method, which does not require a couplant (contact medium). Unlike conventional ultrasonic thickness gauges (UT), there is no need to apply a couplant; thickness measurements can be taken simply by placing the probe on the measurement target, making it ideal for beginners and screening in large-scale sites. It can measure materials with paint, scale, thick linings, and slight surface roughness, significantly reducing the hassle of pre-treatment. Additionally, it is equipped with WiFi communication capabilities, allowing for the confirmation and management of measurement data and waveforms in conjunction with smartphones and tablets. This facilitates smooth sharing of measurement results and data management on-site. It is optimal for measuring wall thickness and conducting corrosion inspections of plant equipment, piping, tanks, and steel structures. It contributes to the efficiency and reliability of thickness measurements in the field of non-destructive testing (NDT), such as maintenance inspections and equipment diagnostics.