Strain measurement of power module package resin.

Measuring the strain behavior of the sealing resin under thermal cycling using a strain gauge!

We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in a mounted state on a circuit board and in an unmounted state. In the mounted module, it was observed that the temperature change was slightly slower, and correspondingly, the change in strain was also slow. This is believed to be due to the delayed transfer of heat to the module when it is mounted. 【Test Overview】 ■ Strain Gauge Used - Foil strain gauge for composite materials: compatible linear expansion coefficient 1x10^-6, base 15x5mm ■ Test Conditions - Hold at -40℃ for 3 hours → 15℃/min → Hold at 80℃ for 3 hours * 5 cycles * For more details, please download the PDF or feel free to contact us.

• Other measurement, recording and measuring instruments

Support for the difficulties in the development and evaluation of components, devices, and materials related to semiconductor products.

【Testing, Evaluation, Analysis】 　●Reliability Testing 　　■Temperature Cycle Testing 　　■Thermal Shock Testing 　　■High-Temperature Storage Testing 　　■Highly Accelerated Life Testing 　　■Preconditioning 　　■Hot Oil Testing 　　■In-situ Continuous Measurement 　　■Ion Migration Testing 　　■Electromigration Testing 　　■Test Consulting 　●Evaluation Testing 　　■Bond Strength Testing: Pull/Shear Testing 　　■Mechanical Strength Testing: Vibration/Shock/Fall Testing/Compression Strength/Shear Strength 　　■ESD/Latch Up/CDM Testing 　　■Electrical Characteristic Measurement 　　■Salt Spray Testing 　●Analysis 　　■X-ray Transmission Observation 　　■Ultrasonic Microscope Observation 　　■Luminescence Analysis (EMS/IR-OBIRCH) 　　■Scanning Electron Microscope (SEM) 　　■Transmission Electron Microscope (TEM) 　　■Surface Contamination Analysis (TOF-SIMS) 　　■Foreign Substance Analysis (FT-IR)

• Other contract services

By applying chemical etching, ion milling, and FIB processing to mechanical polishing, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, it is important to observe not only the shape but also the metal structure.

• Contract Analysis
• Contract measurement
• Other contract services

Introducing the perspectives from which analysis and analytical techniques should be advanced!

Our company supports customers in solving their challenges and issues not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point for problem-solving and provides assistance in unraveling issues for our customers. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other analyses

Two high-power constant temperature and humidity chambers have been introduced! Ideal for temperature cycle tests and temperature and humidity cycle tests for automotive parts and more.

At AITES Co., Ltd., we offer "environmental testing in a high-power constant temperature and humidity chamber." We can achieve a constant temperature change of up to 15°C/min (-45 to ±155°C). Temperature cycle tests can be conducted by controlling the temperature gradient. Additionally, the temperature control range is wider than that of typical constant temperature and humidity chambers, allowing control at 95°C. 【Features】 ■ Two high-power constant temperature and humidity chambers introduced ■ Constant temperature change of up to 15°C/min (-45 to ±155°C) possible ■ Temperature cycle tests can be conducted by controlling the temperature gradient ■ Wider temperature control range than typical constant temperature and humidity chambers ■ Controllable at 95°C *For more details, please refer to the PDF materials or feel free to contact us.

• Contract Analysis
• Contract measurement
• Contract Inspection

Contracting power cycle tests using a power cycle testing device! We will cooperate in improving quality along with failure analysis and assessment.

At Aites Co., Ltd., we offer contract power cycle testing using Siemens (Mentor) power cycle testing equipment. We can also handle the creation of various jigs necessary for the tests. Additionally, we accommodate various observations and measurements of power devices. We can capture changes before and after tests such as power cycle testing. 【Features】 ■ We can handle the creation of various jigs necessary for the tests. ■ We accommodate various observations and measurements of power devices. ■ We can capture changes before and after tests such as power cycle testing. *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis
• Contract measurement
• Contract Inspection

Applicable to change observation, with support for additional analysis! We evaluate the subject in a time series and non-destructive manner.

During reliability testing, the samples change continuously. Do you have any questions such as "At what point did the crack occur?", "How does the degradation progress?", or "How much has it changed from the initial state?" By combining this with reliability testing, we will evaluate the subject in a time-series and non-destructive manner. 【Features】 ■ Applicable for observing changes in whiskers, migration, pressure resistance, solder evaluation, chemical erosion tests, and aging products in the market ■ Environmental tests and observation frequency will be conducted according to customer requirements ■ Additional analyses such as electrical characteristics, SEM observation, elemental analysis, and cross-sectional observation are also available *For more details, please refer to the PDF document or feel free to contact us.

• Testing Equipment and Devices
• Other inspection equipment and devices
• Contract Inspection

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis regarding the malfunctioning part!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu office in 1993, we have cultivated our own unique analysis and evaluation techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 ■ OBIRCH analysis supports not only Si but also SiC and GaN devices ■ FIB processing is possible from either side ■ Visualization of the depletion layer formed at the PN junction ■ Elemental analysis such as EDS and EELS is also supported *For more details, please refer to the PDF document or feel free to contact us.

• Semiconductor inspection/test equipment
• Contract Analysis
• Analysis Services

It is also possible to estimate the relationship with molecular-level structures! Introducing the types of thermal analysis and the properties that can be understood.

When heat is applied to materials, various properties change. Thermal analysis is suitable for investigating such properties. Depending on the changes in the properties we want to observe, we use different devices and combine them as necessary. By understanding the various changes that occur when materials are subjected to heat, we can gain insights into how they will behave in practical applications. When combined with other chemical analyses, it is also possible to estimate the relationship with molecular-level structures. If you have any questions about the relationship between materials and heat, please feel free to consult us. 【Analysis Equipment (Excerpt)】 <DSC (Differential Scanning Calorimeter)> ■ Changes observed: Heat flow (exothermic/endothermic) ■ Properties that can be determined: Melting point (freezing point), glass transition, crystallization, specific heat capacity ■ Applicable materials: Plastics, rubber, metals ■ Analysis examples: Measurement of the curing degree of thermosetting resins, measurement of the transformation temperature of shape memory alloys *For more details, please refer to the PDF document or feel free to contact us.

• Analytical Equipment and Devices

Observing the behavior of strain in thermal shock testing! The test materials used are FR-1 and FR-4.

We would like to introduce the "Strain Measurement of Thermal Shock Testing" conducted by our company. A sample with a strain gauge attached was set up in the thermal shock testing device, and the wiring of the strain gauge was connected to an external data logger to record the strain data in real-time during the test. The strain behavior during the thermal shock test was observed for two types of copper-clad laminates, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4. [Test Conditions] ■ Temperature Cycle: -30°C to 120°C ■ Exposure Time at Each Temperature: 30 min ■ Test Materials - FR-1 Paper Phenolic (Double-sided board) - FR-4 Glass Epoxy (Double-sided board) ■ Strain Gauge: Foil strain gauge for printed circuit boards *For more details, please refer to the PDF document or feel free to contact us.

• Contract Analysis

We investigated the behavior of strain during moisture absorption and drying using a strain gauge!

We would like to introduce the results of our investigation into the behavior of strain during moisture absorption and drying using strain gauges. It was observed that the material expands when absorbing moisture and contracts back to its original state when drying, with the strain returning to the condition prior to moisture absorption. Regarding FR-1, it is presumed that it did not return to its original state due to changes in the chemical structure of the material caused by hydrolysis. 【Test Overview】 ■ 85℃ 50% ⇒ 85℃ 85% ⇒ 85℃ 50% ■ Test Materials ・FR-1 Paper Phenolic (single-sided board) ・FR-4 Glass Epoxy (single-sided board) ■ Strain Gauge ■ Foil Strain Gauge for Composite Materials *For more details, please download the PDF or feel free to contact us.

• Contract measurement

We exhibited a booth at the "4th Annual Meeting of the Japanese Society for Antibody Research" held at Omiya Sonic City from December 1 (Monday) to December 3 (Wednesday). Thank you very much to everyone who visited our booth during the event. Thanks to your support, we were able to successfully conclude the meeting. If you have any questions regarding the products you viewed, please feel free to reach out to us. We will respond to inquiries received during the event in due course. We appreciate your continued support of Higuchi Shokai. ▼Exhibited Products - Various assembly parts (bags, bottles, sampling, etc.) - Depth filters (post-culture filtration)

● This is a leak testing device for small electronic components that does not use fluorinated inert liquids (PFAS-free). ● There is no longer a need for unstable visual confirmation through liquid immersion testing. It adopts a quantitative testing method that allows for stable pressure leak testing. ● It is a tabletop leak testing device specifically for gross leaks, with accuracy equal to or greater than that of liquid immersion testing. ● The detectable range is approximately 1×10⁻² Pa·m³/s to 1×10⁻⁶ Pa·m³/s (varies depending on the target product). ● It is suitable for sealed structures ranging from a few millimeters to a maximum of 80 × 70 mm. Please feel free to contact us for more information!

The "Mechanical Stitch Method" by Nichinichisui Road Machinery Co., Ltd. is a new technique that allows for the repair of metal cracks without the application of heat. By using special bolts and reinforcement plates, cracks are physically removed, and repairs are made without causing any thermal impact to the base material. Repairs can be carried out in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. ◎ For more details, please contact us. ◎ If a detailed technical explanation is needed, please contact us.

Do you have any concerns or requests regarding wired bed exit sensors? × Tangling and tripping of wired cables × Cable disconnection or damage × Worry about forgetting to turn on the switch after temporarily stopping the sensor. × Want to be notified of bed exit even from a location away from the nurse call outlet. Such concerns can be resolved simply by connecting to a wireless set linked to the nurse call system! Our nurse call linked wireless set allows you to connect bed exit sensors like "Ugo-kun," "Foldable Thin Matta-kun," "Ayumi-chan," and "Just Place Pole-kun" to transmitters and receivers, reducing wiring around the bed, alleviating concerns about tripping and falling due to cables, and contributing to a tidier work environment. Furthermore, it enables the use of bed exit sensors even from locations away from the nurse call outlet, allowing for more flexible equipment placement.

The pinhole inspection for packaging engineering is fully automated, eliminating packaging defects based on certain quality standards. The judgment results and operational status can be managed via a monitor screen. - Quantitative management of quality standards for the pinhole inspection process - Ensuring the quality of the product's shelf life - Establishing evaluation criteria for the manufacturing process, achieving quantitative quality assurance - Slim and space-saving design that can be connected to existing production lines - Quick changeover for product variety switching can be handled in a short time by exchanging chambers - Fully domestically produced, allowing for rapid maintenance and troubleshooting - Example target works: pillow packaging, packaged rice (packaged cooked rice), etc. *Please consult us regarding the use of this product for pharmaceuticals.