The Relationship Between Materials and Heat: An Introduction to Thermal Analysis

We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in the mounted state on a circuit board and in the unmounted state. In the mounted module, a slight delay in temperature change was observed, and correspondingly, the change in strain also appeared to be delayed. This is believed to be due to the slower transfer of heat to the module when it is mounted. At Aites, we conduct temperature cycle tests and temperature-humidity cycle tests, during which we can simultaneously measure the strain occurring in the mounted components. Please feel free to consult with us.

When heat is applied to materials, various properties change. Thermal analysis is suitable for investigating such properties. Depending on the changes in the properties to be observed, different devices are used and combined as necessary. By understanding the various changes that occur when materials are subjected to heat, we can gain insights into how they will behave in practical applications. When combined with other chemical analyses, it is also possible to estimate relationships with molecular-level structures. For more details, please refer to the related materials. 【Analysis Equipment (Excerpt)】 <DSC (Differential Scanning Calorimeter)> ■ Changes observed: Heat flow (exothermic/endothermic) ■ Properties that can be determined: Melting point (freezing point), glass transition, crystallization, specific heat capacity ■ Applicable materials: Plastics, rubber, metals ■ Analysis examples: Measurement of the curing degree of thermosetting resins, measurement of the transformation temperature of shape memory alloys.