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  6. Strain measurement of power module package resin.

Strain measurement of power module package resin.

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last updated:Jun 26, 2025

アイテス
アイテス
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Measuring the strain behavior of the sealing resin under thermal cycling using a strain gauge!

We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in a mounted state on a circuit board and in an unmounted state. In the mounted module, it was observed that the temperature change was slightly slower, and correspondingly, the change in strain was also slow. This is believed to be due to the delayed transfer of heat to the module when it is mounted. 【Test Overview】 ■ Strain Gauge Used - Foil strain gauge for composite materials: compatible linear expansion coefficient 1x10^-6, base 15x5mm ■ Test Conditions - Hold at -40℃ for 3 hours → 15℃/min → Hold at 80℃ for 3 hours * 5 cycles * For more details, please download the PDF or feel free to contact us.

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Strain

Strain measurement of power module package resin.

Strain measurement.png
Strain measurement.png
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Strain measurement of power module package resin.

Strain measurement of power module package resin.

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Total solutions for the reliability of semiconductor products.

Total solutions for the reliability of semiconductor products.

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Analysis of the assembly joints of the implemented components

Analysis of the assembly joints of the implemented components

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The nature of analysis techniques, including defect analysis of joints, adhesion, and assembly parts.

The nature of analysis techniques, including defect analysis of joints, adhesion, and assembly parts.

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Environmental testing in a high-power constant temperature and humidity chamber.

Environmental testing in a high-power constant temperature and humidity chamber.

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Power cycle testing and characteristic evaluation

Power cycle testing and characteristic evaluation

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Observation of time-dependent changes associated with reliability testing.

Observation of time-dependent changes associated with reliability testing.

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Power semiconductor analysis service

Power semiconductor analysis service

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The relationship between materials and heat - Introduction to thermal analysis

The relationship between materials and heat - Introduction to thermal analysis

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Strain measurement in thermal shock testing.

Strain measurement in thermal shock testing.

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Measurement of moisture absorption distortion

Measurement of moisture absorption distortion

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Strain measurement of power module package resin.

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We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, both in the mounted state on a circuit board and in the unmounted state. In the mounted module, a slight delay in temperature change was observed, and correspondingly, the change in strain also appeared to be delayed. This is believed to be due to the slower transfer of heat to the module when it is mounted. At Aites, we conduct temperature cycle tests and temperature-humidity cycle tests, during which we can simultaneously measure the strain occurring in the mounted components. Please feel free to consult with us.

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アイテス

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Electronic Components and Semiconductors

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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