Supports high-difficulty processing of hard materials! Dicing processing of fragile chips like Low-k wafers can be done without damage.
The Low-k film used as an insulating film on high-density wiring wafers has low mechanical strength, and in typical blade dicing, there was a risk of damaging the wiring layer and causing film delamination. The process of removing the wiring layer, including the Low-k film, using a laser saw is called laser grooving. We can also process shuttle wafers of different chip sizes, so we can accommodate prototype wafers in the development stage. In addition to Low-k wafers, we can also process narrow street wafers with widths of 20um or less, depending on your requirements.
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basic information
Shipping is possible in the conditions of "Back surface polished complete," "Dicing complete," and "Bare die: Chip tray storage complete," and we can also accommodate packaging assembly and shipping.
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Applications/Examples of results
■Supported wafer diameter: 6 to 12 inches
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Company information
Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.