Packaging with a special technique! Achieving high functionality!
● Pre-molded hollow package This is a package in which the cavity is pre-formed with molded resin, resulting in a hollow interior. It allows for packaging at a lower cost compared to cavity-type substrates such as ceramic substrates.
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basic information
【Basic Flow】 - Wafer acceptance - Wafer back grinding - Dicing (D/C, D/S) - Die bonding (die attach), flip chip - Wire bonding - Molding - Marking - Package dicing (singulation) - Testing - Visual inspection - Packaging, shipping
Price range
Delivery Time
Applications/Examples of results
【Applicable Examples】 - Optical sensors, encoder light receiving sections - Various types of sensors
Company information
Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.
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