We will accommodate various stud bump processing according to your specifications.
Stud bump processing is essential in flip chip mounting technology. Our company can form stud bumps even from a single wafer. We can also process two-tier bumps. We provide leveling support. We can accommodate wafer sizes up to a maximum of 12 inches. We support individual chips, bare wafers, tape-mounted wafers, and reconstructed wafers.
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Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.