For semiconductor back-end processes and electronic component assembly processes! Contributes to high quality, high reliability, and improved productivity.
The "CL Series" is a chip-level coater that accommodates semiconductor chips, electronic components, and modules. It is capable of applying various shapes such as dots, lines, bezels, pillars, circles, and solid fills. In addition, we also offer the "CL Series," which can handle 4, 6, 8, and 12-inch wafers and glass substrates, as well as the "ES Series," which is compatible with 4-inch wafers and various types of workpieces. [Supported Features (Partial)] ■ High throughput ■ Guard ring and dam formation ■ Sealing of chips, electrodes, etc. ■ High viscosity liquids (1000 Pa·s or more) ■ Full wafer/dot/line coating *For more details, please refer to the PDF materials or feel free to contact us.
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【Other Correspondence Details】 ■ Full/local coating of various substrates ■ No overflow/wrapping (no rinsing required) ■ Thick coating, micro coating, fine coating *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Engineering Lab, as a professional in fine coating, develops, manufactures, and sells precision coating equipment. We offer a lineup specialized in precision coating, including the "Twin Air Dispenser," which utilizes patented technology to achieve the world's smallest coating, the high-speed precision coating piezo jet dispenser "X-JET," and the "Spiral Coater," which allows spray coating without the need for masking. We enable high-precision micro-coating of high-viscosity liquids, which was difficult with conventional technology, achieving ultra-fine coating with a minimum application amount of 20 pL. Additionally, Engineering Lab has a wide range of inline fully automatic coating systems suitable for mass production and tabletop coating systems suitable for R&D, providing the optimal coating equipment according to application and work size.