We offer a tabletop manual wire bonder with over 9,000 units in operation worldwide, including wedge bonding tools. Our support system is also robust.
Micro Point Pro Co., Ltd. has 40 years of experience and expertise since its establishment, and offers a wide range of products for the semiconductor and microelectronics device assembly industry. Based in Israel, it is supported by 150 employees and 600 employees from group companies. MPP covers all manufacturing processes from raw materials to finished products and has numerous achievements with many global companies. 【Products Offered】 ■ Wedge bonding tools (fine wire and heavy wire wedge tools) ■ Die collet ■ Manual wire bonders ■ Pick & place and flip chip tools ■ Dispensers & solder jet ball tools ■ Surface mount dispensers & nozzles
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【Other Products】 ■Special Ceramics & Hard Metal Products ■Thin Film & Coating Treatment ■Probe Heads for Wafer Resistance Measurement *You can download the English version of the catalog. *For more details, please refer to the PDF document or feel free to contact us.
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*You can download the English version of the catalog. *For more details, please refer to the PDF document or feel free to contact us.
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Micro Point Pro Ltd (MPP) was established in 2010 following the acquisition of the backend tool manufacturing line from Kulicke & Soffa (K&S). This acquisition included knowledge and know-how supported by highly skilled employees with over 40 years of experience. Since then, MPP has established itself as a global leader in both backend and frontend in the semiconductor market. We have been able to provide comprehensive solutions to meet the evolving needs of our customers through the development and acquisition of additional manufacturing processes. MPP has the capability and expertise to respond to the demand and support for high-precision consumable tools in the microelectronics industry. Our products cover all major packaging processes and applications, specializing in probe head solutions for resistance measurement testing of wafers or thin conductive films.