Publishing the printing results of bump printing and thick film printing! Clearly explained with illustrations.
This document introduces the "solder paste printing machine" handled by Tani Electric Industry. It includes features, as well as printing results for fine printing, bump printing, and thick film printing. The information is presented clearly along with illustrations, so please take a moment to read it. 【Contents (excerpt)】 ■Feature 1: Press-fit cassette squeegee ■Feature 2: Dry cleaner ■Feature 3: Backup plate separation ■Further fine printing: Squeegee ■Further fine printing: Others *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Other Published Content】 ■Printing Results Bump Printing - 1 to 5 ■Printing Results Thick Film Printing *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our business consists of three core areas: SMT (Surface Mount Technology) related business, semiconductor related business, and product development business. Our strength lies in providing one-stop services from assembly of printed circuit boards utilizing the features of our in-house developed solder paste printing machines to unit assembly and repair services for touch panels and display products. Additionally, we are capable of producing products certified under ISO9001, ISO14001, as well as ISO13485 for medical devices and UL standards. On the other hand, in the semiconductor related business, we have solved many customer challenges with our advanced printing technology and know-how. We are developing a business model where our main SMT related business and semiconductor related business are supported by the product development business from both software and hardware perspectives.