Exhibition Invitation for Implementation Process Technology Exhibition from June 10 (Wednesday) to June 12 (Friday)
We will showcase a product that integrates inspection technology into soldering equipment, achieving process improvement!
Koki Tech Co., Ltd. will be exhibiting at "JISSO PROTEC 2026 (27th Assembly Process Technology Exhibition)" held at Tokyo Big Sight. We plan to showcase the "Soldering Equipment SELBO III," which integrates inspection technology into traditional soldering equipment, aiming to reduce soldering defects to an absolute minimum and achieve process improvement. At this exhibition, we will also display and demonstrate soldering equipment and inspection machines equipped with new methods. We sincerely look forward to your visit. 【Event Overview】 ■ Date: June 10 (Wed) - 12 (Fri), 2026, 10:00 AM - 5:00 PM ■ Venue: Tokyo Big Sight ■ Address: 3-11-1 Ariake, Koto-ku, Tokyo 135-0063 ■ Nearest Stations: - Rinkai Line, Kokusai-Tenjijo Station (about a 7-minute walk) - Yurikamome, Tokyo Big Sight Station (about a 3-minute walk) ■ Our Booth: East Hall 1, 1A-28 *For more details, please refer to the related links or feel free to contact us. *The main image is a photo of our exhibition booth from 2025.
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【Exhibited Products】 ■ Selective Soldering Machine "Soldering Machine SELBO III-350V" ■ Compact Visual Inspection Machine "SE100" + Collaborative Robot ■ Desktop Selective Soldering Machine "ULTIMA-TRZ II" ■ Desktop Selective Spray Machine "ULTIMA-SPZ II" ■ All-in-One Soldering Machine "ULTIMA-NEO-L316" ■ High-Speed 3D Compatible Model for PCB Visual Inspection "RV-2-3DH" ■ Solder Paste Dispenser "SD-3325" ■ External Fracsa Type Wave Soldering Machine "FLOX-350" (First Exhibition) *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
