Introducing the inspection equipment owned by Tateyama Denka Kogyo Co., Ltd., a company specializing in PGA pin and chip resistors and connector plating processing!
We would like to introduce the inspection equipment used at Tateyama Denka Kogyo Co., Ltd. We possess inspection equipment related to film thickness and film properties, as well as surface analysis, dimensional inspection equipment, and liquid analysis-related inspection equipment. For film thickness and film properties inspection equipment, we conduct inspections and measurements using non-destructive methods such as "X-ray fluorescence thickness gauges" and "solder wettability testers" to accurately measure plating films. 【Inspection and Measurement Equipment Lineup】 ■ X-ray fluorescence thickness gauge ■ Destructive thickness measuring device ■ Product cross-section thickness measuring device ■ Solder wettability tester *For more details, please refer to the PDF document or feel free to contact us.
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Our company performs plating processes for chip resistors, connectors, and ceramic substrates for LEDs. As a result of our aim to be a trusted and necessary company that responds to any changes in our customers' needs, we receive requests for world-class products. From the field of surface treatment, we strive to be a company that supports the electronic components industry, including automotive and semiconductors, prioritizing the trust of our customers, maintaining a spirit of challenge, and working hard to continue growing.
