Plating process aimed at providing functionality for solder mounting on electrode parts sized 1005 to 6330!
We are conducting plating processes aimed at providing functionality for solder mounting on electrode parts ranging from size 1005 (L×W = 1.0mm×0.5mm) to size 6330 (L×W = 6.3mm×3.2mm). This is controlled by fully automatic barrel plating equipment based on plating conditions (master data) determined by size and resistance values, responding to customer requirements. The sorting after plating is constructed using our self-developed process that utilizes shape differences. 【Product Overview】 ■ Plating Types ・ Finish Plating: Tin Plating ・ Under Plating: Nickel Plating ■ Plating Method: Automatic Barrel Plating Method ■ Supported Products: Various Surface Mount Resistors *For more details, please refer to the PDF document or feel free to contact us.
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Our company performs plating processes for chip resistors, connectors, and ceramic substrates for LEDs. As a result of our aim to be a trusted and necessary company that responds to any changes in our customers' needs, we receive requests for world-class products. From the field of surface treatment, we strive to be a company that supports the electronic components industry, including automotive and semiconductors, prioritizing the trust of our customers, maintaining a spirit of challenge, and working hard to continue growing.