We handle lead-free solder ball bump mounting processes and solder bump mounting processes using printing methods.
When implementing chips onto a base substrate, we will first respond to customers considering joining with solder bumps through prototypes. We have previously provided prototypes using plating processes, but this time we will introduce ball bump mounting methods and printing methods. Our main focus is on prototype processing, so we can accommodate small lots. There are some constraints regarding work size and bump diameter, but we welcome any inquiries you may have.
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basic information
Our company also handles the processing of solder bumps in addition to Au bumps and Cu bumps for implementation. We mainly deal with lead-free ball bump mounting processing and bump mounting processing using printing methods. If you have prototype projects such as implementation tests, please feel free to consult with us. We can accommodate either providing the circuit boards ourselves or using boards supplied by you. Additionally, we accept small-lot prototype requests.
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Applications/Examples of results
[Work Size and Type] 4 to 8-inch Si wafers (12-inch available upon separate consultation) Other printed circuit boards, FPC, etc. 50mm to 250mm, thickness of 0.2mm or more (less than this available upon separate consultation) [Solder Composition] Various types of binary and ternary lead-free solder, low melting point (Sn/Bi-based), eutectic, high melting point available upon separate consultation [Bump Specifications] Printing method, pitch: prototype 80μm and above, mass production 125μm and above Mounting method, pitch: prototype 90μm and above, mass production 150μm and above Ball size: prototype φ55μm and above, mass production φ70 to 650μm [Outline Process] Ball bump: substrate provided (manufacturing also possible) → incoming inspection → flux printing → ball mounting → inspection and repair → reflow → cleaning and shipping inspection → shipping Printing bump: substrate provided (manufacturing also possible) → incoming inspection → cream solder printing → simple inspection → reflow → cleaning and shipping inspection → shipping
Detailed information
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This is an image of the ball bump implementation and a sample image from above. We also support up to reflow. Additionally, depending on the case, we can also handle reflow only.
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Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.
