For high-performance ceramic substrates, please consult our specialized manufacturer.
Mold Press Processing for Green Sheets Our ceramic substrate manufacturing involves firing green sheets, which are coated sheets made from blended raw materials. These green sheets are soft and in sheet form before sintering, making processes like slitting and mold processing relatively easy. By applying press processing using high-precision molds for these sheet processes, we can accommodate processing specifications such as "irregular shapes," "through holes," and "split slits" on the ceramic substrates after sintering.
Inquire About This Product
basic information
For example, after processing a split slit (depth 0.03 mm) into a thin ceramic substrate (t=0.17) using a mold, it becomes easy to perform splitting along this slit when it is laminated into a substrate. (Similar to splitting chocolate) Microfabrication using high-precision mold pressing By performing mold pressing on green sheets processed through an in-house integrated process, we achieve molding that meets customer specifications. In particular, by utilizing precision mold pressing technology, "fine and microfabrication" becomes possible. In the case of chip resistors, we have a production record of the minimum chip size: 0603 (0.6 mm × 0.3 mm). We have also achieved mass production with a minimum depth of 0.08 mm for split slits. By applying advanced slit management, we can provide "split chip sizes of 50% of the board thickness." We are not limited to flat substrate shapes; we also accommodate three-dimensional mold pressing, with proven results in molding "three-dimensional pillar chips" of less than 0.5 mm.
Price range
Delivery Time
Applications/Examples of results
Application to various microfabrication High-precision mold press processing can also be applied to micro hole diameter processing. In through-hole processing applied to printed circuit boards, a minimum hole diameter of 0.2 mm is achievable, accommodating various hole shapes. Additionally, if necessary, we can also accommodate "laser processing" by partner companies. This allows for the processing of complex shapes that are difficult to achieve with mold forming, so please feel free to consult with us.
Detailed information
-
Example of micro via processing for small chips.
-
It is also possible to process a flat green sheet with uneven textures.
-
Case study of micro hole diameter processing by mold forming (minimum diameter: Φ0.2mm)
Company information
Kyoritsu Elex Co., Ltd. is a specialized manufacturer of ceramic substrates for electronic circuits that has been in business for over half a century since its establishment. Our products are widely used as key components in the internal electronic parts of various products, including mobile phones, computers, LCD televisions, automotive control circuits, and more. Based on the know-how we have cultivated over the years, we aim to continue supplying products that meet the needs of the times to the ever-evolving electronics industry, and we aspire to contribute to the creation of a richer society.
